IP Library Granted Patent US 7,512,038
Granted Patent B2
US 7,512,038 · App. 11/671,040 · Granted Mar 31, 2009

Ultrasonic transducer and manufacturing method

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Quick Facts
Patent No.
US 7,512,038
App. No.
11/671,040
Granted
Mar 31, 2009
Kind
B2
Abstract

This invention provides a technique whereby, even if a step is produced by splitting a lower electrode into component elements, resistance increase of an upper electrode, damage to a membrane and decrease of dielectric strength between an upper electrode and the lower electrode, are reduced. In an ultrasonic transducer comprising plural lower electrodes, —an insulation film covering the lower electrodes, —plural hollow parts formed to overlap the lower electrodes on the insulation film, —an insulation film filling the gaps among the hollow parts, an insulation film covering the hollow parts and insulation film, plural upper electrodes formed to overlap the hollow parts on the insulation film and plural interconnections joining them, —the surfaces of the hollow parts and insulation film are flattened to the same height.

Claims (14)

1. A method of manufacturing an ultrasonic transducer, comprising the steps of:

(a) patterning a conductive film to form a first electrode;

(b) forming a first insulation film covering said first electrode;

(c) flattening said first insulation film to expose the surface of said first electrode;

(d) forming a second insulation film covering said first electrode and said first insulation film;

(e) forming a sacrifice layer overlapping said first electrode on said second insulation film;

(f) forming a third insulation film covering said sacrifice layer and said second insulation film;

(g) forming a second electrode overlapping said sacrifice layer on said third insulation film;

(h) forming an interconnection joined to said second electrode;

(i) forming a fourth insulation film covering said second electrode, said interconnection and said third insulation film;

(j) forming an opening penetrating said third insulation film and said fourth insulation film to reach said sacrifice layer;

(k) forming a hollow part by removing said sacrifice layer using said opening; and

(l) filling said opening with a fifth insulation film to seal said hollow part.

2. The method of manufacturing an ultrasonic transducer according to claim 1 , wherein the thickness of said first electrode is 500 nm or more.

Assignments (7)
MERGER Recorded Jan 10, 2025
From: FUJIFILM HEALTHCARE CORPORATION
To: FUJIFILM CORPORATION
Reel/Frame 069869/0560 →
MERGER Recorded Oct 11, 2024
From: FUJIFILM CORPORATION
To: FUJIFILM CORPORATION
Reel/Frame 069162/0756 →
CORRECTIVE ASSIGNMENT TO CORRECT THE THE PROPERTY AND APPLICATION NUMBERS PREVIOUSLY RECORDED AT REEL: 058026 FRAME: 0559. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 31, 2022
From: HITACHI LTD.
To: FUJIFILM HEALTHCARE CORPORATION
Reel/Frame 058917/0853 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 4, 2021
From: HITACHI, LTD.
To: FUJIFILM HEALTHCARE CORPORATION
Reel/Frame 058026/0559 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 6, 2017
From: HITACHI ALOKA MEDICAL, LTD.
To: HITACHI, LTD.
Reel/Frame 041891/0325 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 6, 2014
From: HITACHI, LTD.
To: HITACHI ALOKA MEDICAL, LTD.
Reel/Frame 033045/0609 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 25, 2007
From: MACHIDA, SHUNTARO; ENOMOTO, HIROYUKI; TADAKI, YOSHITAKA
To: HITACHI, LTD.
Reel/Frame 019209/0909 →