Window glass for vehicle
View Patent ↗A window glass for a vehicle, wherein the window glass includes a glass plate, a conductor formed on a surface of the glass plate and an electronic component electrically connected to the conductor via a solder, wherein the solder has gap portions formed therein, is lead-free and contains a buffer component and a conductive component, and wherein the conductive component is present in the solder in an amount of 58-93 volume %, based on a total volume of the solder, or the solder has a specific gravity of 70-93%, based on a specific gravity of the conductive component, whereby the adhesive strength of the solder and the breaking strength of the glass plate are improved.
1. A window glass comprising a glass plate, a conductor formed on a surface of the glass plate and an electronic component electrically connected to the conductor via a solder, wherein the solder has gap portions formed therein, is lead-free and comprises a buffer component and a conductive component, and wherein the conductive component is present in the solder in an amount of 58-93 volume %, based on a total volume of the solder.
2. The window glass according to claim 1 , wherein the solder is a cream solder, the buffer component is a paste-form flux, the conductive component is a powdered solder and the gap portions are void spaces or comprise a flux resin.
3. The window glass according to claim 1 , wherein the conductive component is a powdered solder having an average particle diameter of 5-100 μm.
4. The window glass according to claim 1 , wherein the conductive component is a powdered solder having an average particle diameter of 20-60 μm.
5. The window glass according to claim 1 , wherein the conductive component is a powdered solder having a solidus temperature of 150-240° C.
6. The window glass according to claim 1 , wherein the conductive component is a powdered solder comprising a Sn—Ag alloy comprising 96.0-99.0 wt. % of Sn and 1.0-4.0 wt. % of Ag.
7. The window glass according to claim 1 , wherein the conductive component is a powdered solder comprising a Sn—Ag—Cu alloy comprising 96.0-99.0 wt. % of Sn, 1.0-4.0 wt. % of Ag and at most 1.2 wt. % of Cu.
8. The window glass according to claim 1 , wherein the conductive component is present in the solder in an amount of 67-87 volume %, based on a total volume of the solder.
9. The window glass according to claim 1 , wherein the solder has a specific gravity of 70-93%, based on a specific gravity of the conductive component.
10. The window glass according to claim 1 , wherein the solder has a specific gravity of 76-90%, based on a specific gravity of the conductive component.
11. A window glass comprising a glass plate, a conductor formed on a surface of the glass plate and an electronic component electrically connected to the conductor via a solder, wherein the solder has gap portions formed therein, is lead-free and comprises a buffer component and a conductive component, and wherein the solder has a specific gravity of 70-93%, based on a specific gravity of the conductive component.
12. The window glass according to claim 11 , wherein the solder is a cream solder, the buffer component is a paste-form flux, the conductive component is a powdered solder and the gap portions are void spaces or comprise a flux resin.
13. The window glass according to claim 11 , wherein the conductive component is a powdered solder having an average particle diameter of 5-100 μm.
14. The window glass according to claim 11 , wherein the conductive component is a powdered solder having an average particle diameter of 20-60 μm.
15. The window glass according to claim 11 , wherein the conductive component is a powdered solder having a solidus temperature of 150-240° C.
16. The window glass according to claim 11 , wherein the conductive component is a powdered solder comprising a Sn—Ag alloy comprising 96.0-99.0 wt. % of Sn and 1.0-4.0 wt. % of Ag.
17. The window glass according to claim 11 , wherein the conductive component is a powdered solder comprising a Sn—Ag—Cu alloy comprising 96.0-99.0 wt. % of Sn, 1.0-4.0 wt. % of Ag and at most 1.2 wt. % of Cu.
18. The window glass according to claim 11 , wherein the solder has a specific gravity of 76-90%, based on a specific gravity of the conductive component.
19. The window glass according to claim 11 , wherein the conductive component is present in the solder in an amount of 58-93 volume %, based on a total volume of the solder.
20. The window glass according to claim 11 , wherein the conductive component is present in the solder in an amount of 67-87 volume %, based on a total volume of the solder.