Modular laser package system
View Patent ↗A modular laser package system may be used to mount one type of laser package, such as a coaxial or TO (transistor outline) can laser package, to a circuit board, such as a transmitter board or a motherboard, designed to receive another type of laser package housing, such as a butterfly-type laser package housing. The modular laser package system may include a circuit board mounting platform, a laser housing mount to mount the laser package to the circuit board mounting platform, and a mounting base to facilitate mounting to the transmitter board or motherboard. The modular laser package system may also include a temperature control device, such as a thermoelectric cooler (TEC), and a temperature sensor, such as a thermistor, mounted to the laser housing mount to control and monitor the temperature of the laser package.
1. A modular laser package system comprising:
a laser package comprising a substantially cylindrical laser-fiber housing, a semiconductor laser optically coupled to an end of an optical fiber within the laser-fiber housing, and electrical leads electrically coupled to the laser and extending from a face of the laser-fiber housing;
a circuit board mounting platform defining a slot region and including contacts, wherein the contacts include at least a first group of the contacts electrically coupled to the electrical leads;
a plurality of pins electrically coupled to at least a second group of contacts and extending laterally from opposing sides of the circuit board mounting platform;
a thermally conductive laser housing mount receiving the laser-fiber housing in a slip fit and mounted within the slot region of the circuit board mounting platform;
a temperature control device mounted to the laser housing mount to control the temperature of the laser package; and
wherein the laser package, the circuit board mounting platform, the pins, the laser housing mount and the temperature control device are oriented and dimensioned to be compatible with a circuit board designed for a butterfly type laser package.
2. The modular laser package system of claim 1 wherein the laser package is selected from the group consisting of a coaxial laser package and a TO can laser package.
3. The modular laser package system of claim 1 further comprising a mounting base coupled to the circuit board mounting platform.
4. The modular laser package system of claim 1 wherein the circuit board is electrically coupled to the laser housing mount.
5. The modular laser package system of claim 1 wherein the laser housing mount, the laser-fiber housing and the circuit board mounting platform have the same ground plane.