IP Library Granted Patent US 7,242,042
Granted Patent B2
US 7,242,042 · App. 11/671,693 · Granted Jul 10, 2007

Solid state image sensing device and manufacturing and driving methods thereof

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Quick Facts
Patent No.
US 7,242,042
App. No.
11/671,693
Granted
Jul 10, 2007
Kind
B2
Abstract

A solid state image sensing device is composed of a second conductive type well area 33 , a photoelectric conversion area 40 , a ring shaped gate electrode 35 , a transfer gate electrode 41 , a second conductive type drain area 38 , a second conductive type source area 36 , and a first conductive type source neighborhood area 37.

Claims (7)

1. A manufacturing method of a solid state image sensing device in which a plurality of unit pixels containing a transistor for outputting a light signal having a ring shaped gate electrode and a photo diode is regularly arranged on a first conductive type substrate, the manufacturing method comprising steps of:

forming a first conductive type source neighborhood area in a prescribed area allocated in a second conductive type well area provided over a surface of the first conductive type substrate;

forming the ring shaped gate electrode on the second conductive type well area with sandwiching a gate insulative film, wherein a center opening of the ring shaped gate electrode is arranged to be allocated above the first conductive type source neighborhood area;

forming a first conductive type high concentration area in the first conductive type source neighborhood area by injecting first conductive type impurity in high concentration into the first conductive type source neighborhood area through the ring shaped gate electrode as a mask;

forming a second conductive type surface layer in high concentration by injecting second conductive type impurity into the first conductive type high concentration area through the ring shaped gate electrode as a mask;

forming a side wall spacer on an inner wall of the center opening of the ring shaped gate electrode; and

forming a second conductive type source area of the transistor for outputting a light signal on the second conductive type surface layer by injecting second conductive type impurity in high concentration into the second conductive type surface layer through the side wall spacer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2019
From: JVC KENWOOD CORPORATION
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 050170/0527 →
MERGER Recorded Apr 9, 2012
From: VICTOR COMPANY OF JAPAN, LTD.
To: JVC KENWOOD CORPORATION
Reel/Frame 028010/0740 →