Low dielectric loss composite material
View Patent ↗Disclosed are composite materials that can exhibit low transmission energy loss and can also be temperature resistant. The composites include reinforcement fibers held in a polymeric matrix. The polymeric matrix can include an amorphous polymer component. Also disclosed are methods of forming the composites. Methods can include forming amorphous thermoplastic polymer fibers, forming a fabric from the fibers, combining the fabric with reinforcement fibers, and molding the structure thus formed under heat and pressure such that the amorphous thermoplastic polymer flows and forms a polymeric matrix incorporating the reinforcement fibers. The composites can be molded from multi-layer structures that can include layers of differing materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates, radomes, antennas, and the like.
1. A composite substrate defining a first surface and an opposing second surface, the composite substrate comprising:
a) a polymeric matrix that includes a fabric comprising fibers of polymer having a dielectric constant of less than 3.0, said polymer comprising an amorphous thermoplastic component, the polymeric matrix including said polymer in an amount of at least 80% by weight of the polymeric matrix, and
b) reinforcement fibers contained within the polymeric matrix,
wherein the composite substrate has a dielectric constant of less than 4.0.
2. The composite substrate of claim 1 , wherein the composite substrate has a dielectric loss of less than 0.004.
3. The composite substrate of claim 1 , wherein the polymer is a cyclic olefin copolymer.
4. The composite substrate of claim 1 , wherein the reinforcement fibers comprise glass fibers.
5. The composite substrate of claim 1 , wherein the composite substrate has a flexural modulus of greater than 9 GPa.
6. The composite substrate of claim 1 , wherein the composite substrate has a density of less than 1.5 g/cm 3 .
7. The composite substrate of claim 1 , wherein the composite substrate is a circuit board.
8. The composite substrate of claim 1 , wherein the composite substrate is a portion of a radome or a portion of an antenna.
9. A composite substrate defining a first surface and an opposing second surface, the composite substrate comprising:
a) a polymeric matrix that includes a fabric comprising fibers of polymer having a dielectric constant of less than 3.0, said polymer comprising an amorphous thermoplastic component, the polymeric matrix including said polymer in an amount of at least about 80% by weight of the polymeric matrix, and
b) woven reinforcement fibers contained within the polymeric matrix,
wherein the composite substrate has a dielectric constant of less than 4.0.
10. The composite substrate of claim 9 , wherein the composite substrate has a dielectric loss of less than 0.004.
11. The composite substrate of claim 9 , wherein the polymer has a dielectric constant of less than 2.9.
12. The composite substrate of claim 9 , wherein the polymer is a cyclic olefin copolymer.
13. The composite substrate of claim 9 , wherein the reinforcement fibers comprise glass fibers.
14. The composite substrate of claim 9 , wherein the composite substrate has a flexural modulus of greater than 9 GPa.
15. The composite substrate of claim 9 , wherein the composite substrate has a density of less than 1.5 g/cm 3 .
16. The composite substrate of claim 9 , wherein the composite substrate is a circuit board.
17. The composite substrate of claim 9 , wherein the composite substrate is a portion of a radome or a portion of an antenna.
18. A composite substrate defining a first surface and an opposing second surface, the composite substrate comprising:
a) a polymeric matrix that includes a polymer having a dielectric constant of less than 3.0, said polymer comprising an amorphous thermoplastic component, the polymeric matrix including said polymer in an amount of at least 80% by weight of the polymeric matrix, and
b) reinforcement fibers contained within the polymeric matrix,
wherein the reinforcement fibers are distributed within the composite substrate such that the average concentration gradient of the reinforcement fibers between the first surface and the second surface is about zero and the composite substrate has a dielectric constant of less than 4.0.
19. The composite substrate of claim 18 , wherein the composite substrate has a dielectric loss of less than 0.004.
20. The composite substrate of claim 18 , wherein the polymer has a dielectric constant of less than 2.9.
21. The composite substrate of claim 1 , wherein the reinforcement fibers comprise glass fibers.
22. The composite substrate of claim 18 , wherein the composite substrate has a flexural modulus of greater than 9 GPa.
23. The composite substrate of claim 18 , wherein the composite substrate has a density of less than 1.5 g/cm 3 .
24. The composite substrate of claim 18 , wherein the composite substrate is a circuit board.
25. The composite substrate of claim 18 , wherein the composite substrate is a portion of a radome or a portion of an antenna.
26. A composite substrate defining a first surface and an opposing second surface, the composite substrate comprising:
a) a polymeric matrix that includes a polymer having a dielectric constant of less than 3.0, said polymer comprising an amorphous thermoplastic component, the polymeric matrix including said polymer in an amount of at least 80% by weight of the polymeric matrix, and
b) reinforcement fibers contained within the polymeric matrix,
wherein the ratio of the polymeric matrix to the reinforcement fibers is greater at the first surface than at an interior area of the composite substrate and the composite substrate has a dielectric constant of less than 4.0.
27. The composite substrate of claim 26 , wherein the composite substrate has a dielectric loss of less than 0.004.
28. The composite substrate of claim 26 , wherein the polymer has a dielectric constant of less than 2.9.
29. The composite substrate of claim 26 , wherein the reinforcement fibers comprise glass fibers.
30. The composite substrate of claim 26 , wherein the composite substrate has a flexural modulus of greater than 9 GPa.
31. The composite substrate of claim 26 , wherein the composite substrate has a density of less than 1.5 g/cm 3 .
32. The composite substrate of claim 26 , wherein the composite substrate is a circuit board.
33. The composite substrate of claim 26 , wherein the composite substrate is a portion of a radome or a portion of an antenna.