IP Library Granted Patent US 7,411,179
Granted Patent B2
US 7,411,179 · App. 11/672,629 · Granted Aug 12, 2008

Photodetector module with impedance matching

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Quick Facts
Patent No.
US 7,411,179
App. No.
11/672,629
Granted
Aug 12, 2008
Kind
B2
Abstract

A photodetector module that can achieve impedance matching and power saving. A photodetector ( 11 ) and an amplifier ( 12 ) for amplifying an electric signal from the photodetector ( 11 ) are mounted on a stem ( 14 ). A dielectric plate ( 18 ) is arranged between the stem ( 14 ) and a flexible substrate ( 20 ). To transfer an electric signal from the amplifier ( 12 ) to the substrate ( 20 ), a lead pin ( 15 d ) is provided to pass through the stem ( 14 ) and the dielectric plate ( 18 ). The output of the amplifier ( 12 ) includes a capacitance component, and the output impedance of the amplifier ( 12 ) is higher than the impedance that matches with the substrate ( 20 ). Further, the thickness d of the dielectric plate ( 18 ) is such that the inductance component of the lead pin ( 15 d ) includes an inductance component that is inductive, which cancels the capacitance component of the amplifier, and impedance matching with the substrate ( 20 ) can be achieved.

Claims (9)

1. A photodetector module that is equipped with a photodetector and is connected to a substrate that is a target of transmission of an electric signal which is photoelectrically converted in the photodetector, the photodetector module comprising:

an amplifier which amplifies the electric signal from the photodetector;

a board on which the photodetector and the amplifier are mounted;

a dielectric placed between the board and the substrate; and

a lead pin extending through the board and the dielectric to the substrate, so as to transfer the electric signal amplified by the amplifier to the substrate; wherein

output of the amplifier includes a capacitance component, and an output impedance of the amplifier is higher than an impedance that matches with the substrate; and

thickness of the dielectric in a direction from the board to the substrate is such that an inductance component of the lead pin includes an inductance component canceling the capacitance component of the amplifier, and impedance matching with the substrate can be achieved.

2. A photodetector module according to claim 1 , wherein:

the photodetector module is a CAN module comprising a metallic stem of a disk shape as the board.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: LUMENTUM JAPAN, INC.
To: LUMENTUMRADIANT GMBH
Reel/Frame 073971/0379 →
CHANGE OF NAME Recorded Jul 2, 2019
From: OCLARO JAPAN, INC.
To: LUMENTUM JAPAN, INC.
Reel/Frame 049669/0609 →
CHANGE OF NAME Recorded Dec 3, 2014
From: OPNEXT JAPAN, INC.
To: OCLARO JAPAN, INC.
Reel/Frame 034524/0875 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 1, 2007
From: SASADA, MICHIHIDE; KAGAYA, OSAMU; OKAMURA, YUKITOSHI
To: OPNEXT JAPAN, INC.
Reel/Frame 019903/0034 →