IP Library Granted Patent US 7,733,603
Granted Patent B2
US 7,733,603 · App. 11/674,443 · Granted Jun 8, 2010

Reduced tape stick tape drive systems

Assignee: Oracle International Corporation
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Quick Facts
Patent No.
US 7,733,603
App. No.
11/674,443
Granted
Jun 8, 2010
Kind
B2
Abstract

A read and/or write head for a tape drive system has a tape bearing surface that includes relatively smooth areas surrounded by relatively rough areas. Read and/or write elements are located in the smooth areas.

Claims (18)

1. A linear tape head module for a linear tape drive system, the system including a tape having a data track, the module comprising:

a substrate having a surface with a roughness;

a thin film, having a surface with a roughness, including a data track element to at least one of read from and write to the data track; and

a closure having a surface with a roughness to cap the thin film wherein the substrate, thin film, and closure surfaces cooperate to provide a tape bearing surface for the tape and wherein a roughness of a predefined portion of the tape bearing surface is less than a roughness of the tape bearing surface outside the predefined portion.

2. The module of claim 1 wherein the data track element includes at least one of a pole tip and shield located in the predefined portion of the tape bearing surface.

3. The module of claim 2 wherein the data track element includes a pole tip and wherein the pole tip protrudes a distance above the tape bearing surface.

4. The module of claim 2 wherein the data track element includes a shield and wherein the shield protrudes a distance above the tape bearing surface.

5. The module of claim 2 wherein the thin film surface includes a plateau to further provide a tape bearing surface for the tape.

6. The module of claim 5 wherein the data track element includes a pole tip and wherein the plateau includes the pole tip.

7. The module of claim 6 wherein the pole tip protrudes a distance above a surface of the plateau.

8. The module of claim 5 wherein the data track element includes a shield and wherein the plateau includes the shield.

9. The module of claim 8 wherein the shield protrudes a distance above a surface of the plateau.

10. The module of claim 5 wherein a height of the plateau varies.

11. The module of claim 5 wherein the plateau has a predefined shape.

12. The module of claim 5 wherein the plateau has a polygonal shape.

13. The module of claim 1 wherein the predefined portion of the thin film surface has a rounded shape.

14. The module of claim 1 wherein the predefined portion of the thin film surface has an elliptical shape.

15. The module of claim 1 wherein the tape has a path direction and wherein the predefined portion of the thin film surface has an elongated shape in the path direction.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Dec 16, 2015
From: ORACLE USA, INC.; SUN MICROSYSTEMS, INC.; ORACLE AMERICA, INC.
To: ORACLE AMERICA, INC.
Reel/Frame 037306/0292 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2007
From: DEE, RICHARD H.
To: SUN MICROSYSTEMS, INC.
Reel/Frame 018892/0377 →
Continuity (1)
Related Publication 20080192380A1 · Aug 14, 2008