Wide-bandgap semiconductor devices
View Patent ↗A device 100 comprising a substrate 115 having crystal-support-structures 110 thereon, and a III-V crystal 210 . The III-V crystal is on a single contact region 140 of one of the crystal-support-structures. An area of the contact region is no more than about 50 percent of a surface area 320 of the III-V crystal.
1. A device, comprising:
a substrate having crystal-support-structures thereon; and
a III-V crystal on a single contact region of one of said crystal-support-structures, wherein an area of said contact region is no more than about 50 percent of a surface area of said III-V crystal, and wherein said crystal-support-structures are made of silicon or sapphire.
2. The device of claim 1 , wherein pillar-shaped ones of said crystal-support-structures have diameters that are about 10 percent or less of a lateral thickness of individual ones of said III-V crystal located on said pillar-shaped ones of said crystal-support-structures.
3. The device of claim 1 , wherein said contact region is located on an upper surface of said crystal-support-structures.
4. The device of claim 1 , wherein a crystal lattice of said contact region and a crystal lattice of said III-V crystal both have substantially hexagonal geometries.
5. The device of claim 1 , wherein said III-V crystal has a substantially lower threading defect density outside of a defect region of said crystal than a threading defect density within said defect region, said defect region being located adjacent to said contact region.
6. A device, comprising:
a substrate having crystal-support-structures thereon; and
a III-V crystal on a single contact region of one of said crystal-support-structures, wherein an area of said contact region is no more than about 50 percent of a surface area of said III-V crystal, wherein said substrate and said crystal-support-structures are both made of silicon, and said III-V crystal includes one or more III-nitrides.
7. The device of claim 1 , wherein said III-V crystal is a merged layer that touches a plurality said contact regions.
8. The device of claim 1 , wherein said crystal-support-structures are electrically conductive and separated ones of said III-V crystals are connected to individual addressable electrically conductive lines.
9. The device of claim 1 , wherein merged ones of said III-V crystals are light-emitting components or light-detecting components of said device.
10. A device, comprising:
a III-V crystal having a uniform crystal orientation except for a defect region that is centrally located in said III-V crystal, wherein said defect region occupies less than about 10 percent of a total volume of said III-V crystal; and
a crystal-support-structure on a substrate, said a III-V crystal being located on a single contact region of said crystal-support-structure, wherein an area of said contact region is no more than about 50 percent of a surface area of said III-V crystal, and wherein said crystal-support-structure is made of silicon or sapphire.
11. The device of claim 10 , wherein a defect density of said defect region is about 1×10 8 cm −2 or greater and a defect density of said III-V crystal outside of said defect region is less than about 1×10 7 cm −2 .
12. The device of claim 10 , wherein said III-V crystal is adhered to an adhesive layer such that said central defect region faces away from said adhesive layer.
13. The device of claim 1 , wherein said crystal-support-structures are made of silicon.
14. The device of claim 1 , wherein said contact region has a substantially similar crystal lattice geometry as a crystal lattice geometry of said III-V crystal.
15. The device of claim 14 , wherein said crystal lattice geometry of said III-V crystal has a hexagonal geometry and said crystal support structure has a (111) orientation thereby providing a hexagonal arrangement of atoms in said contact region.
16. The device of claim 14 , wherein said crystal lattice geometry of said III-V crystal has a cubic geometry and said crystal support structure has a (100) orientation thereby providing a cubic arrangement of atoms in said contact region.
17. The device of claim 1 , wherein a diameter of pillar-shaped ones of said crystal support structure are about 10 percent or less than a diameter of said III-V crystal.
18. The device of claim 1 , wherein said area of said contact region is no more than about 10 percent of said surface area of said III-V crystal.
19. The device of claim 1 , wherein said area of said contact region is no more than about 1 percent of said surface area of said III-V crystal.
20. The device of claim 1 , wherein said crystal-support-structures are made of sapphire.