Doped nanoparticle-based semiconductor junction

1. A method of making a doped semiconductor junction for use in an electronic device comprising:

(a) forming a first polycrystalline semiconductor layer in-situ doped with donors or acceptors over a substrate such that the first doped semiconductor layer has a first polarity, the first layer including colloidal semiconductor nanoparticles, comprising:

(i) growing in-situ doped colloidal semiconductor nanoparticles having surface organic ligands in a colloidal solution;

(ii) depositing the in-situ doped colloidal semiconductor nanoparticles on the substrate;

(iii) performing a first anneal of the deposited in-situ doped colloidal semiconductor nanoparticles so that surface organic ligands with boiling points less than 200° C. boil off the surface of the in-situ doped colloidal semiconductor nanoparticles; and

(b) forming a second layer in contact with the first semiconductor layer over a substrate to form the semiconductor junction; and

(c) performing a second anneal of the deposited in-situ doped colloidal semiconductor nanoparticles, either before or after forming the second layer, whereby the in-situ doped colloidal semiconductor nanoparticles are fused so that a continuous doped semiconductor layer is formed.

2. The method of claim 1 wherein the first anneal is performed at temperatures below 220° C.

3. The method of claim 1 wherein the second anneal is performed at temperatures between 250° C. and 500° C.

4. A method of making a doped semiconductor junction for use in an electronic device comprising:

(a) forming a first polycrystalline semiconductor layer ex-situ doped with donors or acceptors over a substrate such that the first doped semiconductor layer has a first polarity, the first layer including colloidal semiconductor nanoparticles, comprising:

(i) growing a first set of colloidal semiconductor nanoparticles having surface organic ligands in a colloidal solution;

(ii) growing a second set of dopant material colloidal nanoparticles having surface organic ligands in a colloidal solution;

(iii) depositing a mixture of the first set of colloidal semiconductor nanoparticles and the second set of dopant material colloidal nanoparticles on the substrate, wherein there are more colloidal semiconductor nanoparticles than dopant material colloidal nanoparticles;

(iv) performing a first anneal of the deposited mixture of colloidal nanoparticles so that surface organic ligands with boiling points less than 200° C. boil off the surfaces of the first and second set of colloidal nanoparticles;

(b) forming a second layer in contact with the first semiconductor layer over a substrate to form the semiconductor junction; and

(c) performing a second anneal of the deposited mixture, either before or alter forming the second layer, so that the colloidal semiconductor nanoparticles fuse to form a continuous semiconductor layer and the dopant material atoms diffuse out from the dopant material colloidal nanoparticles and into the continuous semiconductor layer to provide an ex-situ doped semiconductor layer.

5. The method of claim 4 wherein the first anneal is performed at temperatures below 220° C.

6. The method of claim 4 wherein the second anneal is performed at temperatures between 250° C. and 500° C.