Illumination device for simulation neon lighting
View Patent ↗An illumination device generally comprises a plurality of light-emitting diodes (LEDs); a housing for receiving the plurality of LEDs; a light-diffusing member positioned adjacent the housing for receiving light emitted from the LEDs; and a slotted and reflective circuit board for operably connecting the LEDs to a power source and/or control system. The flexible substrate can be manipulated from a first, substantially flat position to a second position by folding the substrate along upper and lower longitudinal axes defined by slots oriented longitudinally and along either side of a central longitudinal axis of the substrate, such that the substrate can be inserted into the housing in an approximate U-shape. By manipulating the substrate from the first position to the second position in this manner, light from the LEDs that is not directly emitted into the light-diffusing member is collected and reflected by the circuit board into the light-diffusing member.
1. An illumination device, comprising:
a plurality of light-emitting diodes;
a circuit board receiving and operably connecting said light-emitting diodes;
a housing for receiving said circuit board and said light-emitting diodes; and
a light-diffusing member adjacent said housing for receiving light emitted from said light-emitting diodes;
wherein said circuit board includes
a flexible substrate of a predetermined length having a light-reflecting top surface and a bottom surface, and defining a central longitudinal axis, said substrate further defining a plurality of slots oriented substantially longitudinally on one side of said central longitudinal axis along an upper longitudinal axis and on another side of said central longitudinal axis along a lower longitudinal axis, and
a conductive trace applied to a surface of said flexible substrate for receiving and operably connecting said light-emitting diodes substantially along said central longitudinal axis, and
wherein the flexible substrate of said circuit board is manipulated from a first, substantially flat position to a second position in which said substrate is folded along said upper and lower longitudinal axes into an approximate U-shape, such that when said circuit board is positioned and received in said housing, light from said light-emitting diodes that is not directly emitted into said light-diffusing member is collected and reflected by said circuit board into said light-diffusing member.
2. The illumination device as recited in claim 1 , wherein the substrate is constructed from a light-reflecting material.
3. The illumination device as recited in claim 1 , wherein the light-reflecting top surface of said substrate is a result of the application of a light-reflecting material to the top surface of said substrate.
4. The illumination device as recited in claim 1 , wherein said housing include a pair of side walls.
5. The illumination device as recited in claim 4 , wherein said side walls restrict movement of the substrate and hold the substrate in the approximate U-shape of the second position.
6. A method of manufacturing an illumination device, comprising the steps of:
providing a circuit board, which receives and operably connects a plurality of light-emitting diodes, and includes a flexible substrate defining a plurality of slots oriented longitudinally and along either side of a central longitudinal axis;
manipulating the substrate of the circuit board from a first, substantially flat position to a second position by folding the substrate along the longitudinal axes defined by the slots into an approximate U-shape;
positioning the circuit board in the second position into a housing; and
placing a light-diffusing member adjacent the housing for receiving light emitted directly from the light-emitting diodes and light collected and reflected by the circuit board.
7. The method of manufacturing an illumination device as recited in claim 6 , wherein a conductive trace is applied to a surface of said flexible substrate for receiving and operably connecting said light-emitting diodes substantially along said central longitudinal axis.
8. The method of manufacturing an illumination device as recited in claim 6 , wherein said substrate is constructed from a light-reflecting material.
9. The method of manufacturing an illumination device as recited in claim 6 , wherein light-reflecting material is applied to a top surface of said substrate.
10. The method of manufacturing an illumination device as recited in claim 6 , wherein said housing include a pair of side walls.
11. The method of manufacturing an illumination device as recited in claim 10 , wherein said side walls restrict movement of the substrate and hold the substrate in the approximate U-shape of the second position.