Electronic circuit device and manufacturing method thereof
View Patent ↗The manufacturing method for an electronic circuit device comprises attaching an electronic circuit assembly including a circuit substrate with electronic circuit elements attached to a base, joining lead terminals integrally with the base via frames before molding the lead terminals composed of a different material from that of the base with mold resin, electrically connecting the lead terminals to the electronic circuit assembly, molding the electronic circuit assembly, lead terminals, and flange with mold resin in a batch partially excluding the flange and lead terminals installed on the base, and separating and removing the frames from the lead terminals and base after the molding with the mold resin.
1. An electronic circuit device comprising:
an electronic circuit assembly including a circuit substrate to which electronic circuit elements are attached;
a base having a flange portion, said electronic circuit assembly being adhered to the base; and
lead terminals made of a different member and different material from said base, which are electrically connected to said electronic circuit assembly, wherein said base, said lead terminals are arranged on substantially the same plane, and wherein said base, said electronic assembly, and said lead terminals are sealed with a sealing resin, except for said flange portion, and part of said lead terminals.
2. The electronic assembly according to claim 1 , wherein a thickness of said base is almost the same as that of said lead terminals.
3. The electronic assembly according to claim 1 , wherein said lead terminals are made by cutting a lead frame, which is integrated with said base.
4. The electronic assembly according to claim 1 , wherein said sealing resin is a transfer mold resin.
5. The electronic assembly according to claim 1 , wherein said base is provided with a plurality of holes for fitting it to assembling tools.