ELECTROOPTIC DEVICE, WIRING BOARD, METHOD FOR MANUFACTURING ELECTROOPTIC DEVICE, AND ELECTRONIC DEVICE
An electrooptic device includes: a first substrate including a first terminal group having a plurality of first terminals and a second terminal group having a plurality of second terminals; a second substrate including a third terminal group having a plurality of third terminals that are conductively connected to the plurality of corresponding first terminals; and a third substrate including a fourth terminal group having a plurality of fourth terminals that are conductively connected to the plurality of corresponding second terminals. The plurality of first terminals extend along a plurality of lines passing through a first common point apart from the first terminal group in a predetermined direction intersecting the direction of the array of the first terminals and are arrayed in line symmetry about an axis passing through the first common point. The plurality of second terminals extend along a plurality of lines passing through a second common point apart from the second terminal group in a predetermined direction intersecting the direction of the array of the second terminals and are arrayed in line symmetry about an axis passing through the second common point.
1 . An electrooptic device comprising:
a first substrate including a first terminal group having a plurality of first terminals and a second terminal group having a plurality of second terminals;
a second substrate including a third terminal group having a plurality of third terminals that are conductively connected to the plurality of corresponding first terminals; and
a third substrate including a fourth terminal group having a plurality of fourth terminals that are conductively connected to the plurality of corresponding second terminals; wherein
the plurality of first terminals extend along a plurality of lines passing through a first common point apart from the first terminal group in a predetermined direction intersecting the direction of the array of the first terminals and are arrayed in line symmetry about an axis passing through the first common point; and
the plurality of second terminals extend along a plurality of lines passing through a second common point apart from the second terminal group in a predetermined direction intersecting the direction of the array of the second terminals and are arrayed in line symmetry about an axis passing through the second common point.
2 . The electrooptic device according to claim 1 , wherein the first terminal group and the second terminal group are disposed along the opposite outer rims of the first substrate.
3 . The electrooptic device according to claim 2 , wherein the first common point apart from the first terminal group and the second common point apart from the second terminal group are disposed on the same side.
4 . The electrooptic device according to claim 2 , wherein the first common point apart from the first terminal group and the second common point apart from the second terminal group are disposed on the opposite sides.
5 . The electrooptic device according to claim 4 , wherein the first common point for the first terminal group is disposed on the side of the second terminal group, and the second common point for the second terminal group is disposed on the side of the first terminal group.
6 . The electrooptic device according to claim 4 , wherein the first common point for the first terminal group and the second common point for the second terminal group are apart from the first substrate.
7 . The electrooptic device according to claim 1 , wherein the first substrate is a flexible wiring board.
8 . The electrooptic device according to claim 1 , wherein the thermal expansion coefficient of the first substrate and the thermal expansion coefficients of the second substrate and the third substrate are different.
9 . A wiring board comprising:
a first terminal group including a plurality of first terminals, the first terminals extending along a plurality of lines that substantially pass through a first common point apart from the first terminal group in a predetermined direction intersecting the direction of the array of the first terminals; and
a second terminal group including a plurality of second terminals, the second terminals extending along a plurality of lines that substantially pass through a second common point apart from the second terminal group in a predetermined direction intersecting the direction of the array of the second terminals.
10 . A method for manufacturing an electrooptic device including: a first substrate including a first terminal group having a plurality of first terminals and a second terminal group having a plurality of second terminals; a second substrate including a third terminal group having a plurality of third terminals that are conductively connected to the plurality of corresponding first terminals; a third substrate including a fourth terminal group having a plurality of fourth terminals that are conductively connected to the plurality of corresponding second terminals; wherein
the plurality of first terminals extend along a plurality of lines passing through a first common point apart from the first terminal group in a predetermined direction intersecting the direction of the array of the first terminals;
the plurality of second terminals extend along a plurality of lines passing through a second common point apart from the second terminal group in a predetermined direction intersecting the direction of the array of the second terminals; and
the thermal expansion coefficient of the first substrate and the thermal expansion coefficients of the second substrate and the third substrate are different;
wherein the method comprising:
when the first substrate is mounted to the second substrate by thermocompression bonding, adjusting the positions of the first terminal group and the third terminal group according to the difference between the size changes of the first substrate and the second substrate due to a difference in thermal expansion coefficient; and
when the first substrate is mounted to the third substrate by thermocompression bonding, adjusting the positions of the second terminal group and the fourth terminal group according to the difference between size changes of the first substrate and the third substrate due to a difference in thermal expansion coefficient.
11 . An electronic device comprising the electrooptic device according to claim 1.