Integrated Pedestal Mount for MEMS Structure
A substrate is provided for supporting a MEMS device. The substrate includes a housing with an integral pedestal mount for supporting the MEMS device. The substrate can be combined with a MEMS device to form a sensor.
1 . A substrate for supporting a micro-electro-mechanical system (MEMS) device, the substrate comprising:
a housing including an integral pedestal mount for supporting the MEMS device, the pedestal mount including an inlet hole formed therein.
2 . The substrate according to claim 1 , wherein the pedestal mount is elongate.
3 . The substrate according to claim 1 , wherein the pedestal mount has a smaller diameter than a cross section of the MEMS device.
4 . The substrate according to claim 1 , wherein the housing comprises a ceramic.
5 . The substrate according to claim 1 , wherein the housing comprises a polymer.
6 . A sensor, comprising:
the substrate according to claim 1 ; and
the MEMS device.
7 . The sensor according to claim 6 , wherein the pedestal mount is elongate.
8 . The sensor according to claim 6 , wherein the pedestal mount has a smaller diameter than a cross section of the MEMS device.
9 . The sensor according to claim 6 , wherein the housing comprises a ceramic or a polymer.
10 . The sensor according to claim 6 , further comprising wire bonds for outputting signals from the sensor.
11 . The sensor according to claim 6 , wherein the MEMS device comprises a pressure sensor.
12 . A method of manufacturing a sensor, comprising:
forming a substrate for supporting a micro-electro-mechanical system (MEMS) device, such that the substrate comprises a housing with an integral pedestal mount for supporting the MEMS device, the pedestal mount including an inlet hole formed therein; and
bonding the MEMS device directly to the pedestal mount.
13 . The method according to claim 12 , wherein the substrate is formed via a multi-layering technique or molding technique.
14 . The method according to claim 12 , wherein the substrate is formed such that the pedestal mount is elongate.
15 . The method according to claim 12 , wherein the substrate is formed such that the pedestal mount has a smaller diameter than a cross section of the MEMS device.
16 . The method according to claim 12 , wherein the housing is formed of ceramic or a polymer.
17 . The method according to claim 12 , wherein the sensor is formed to include bonding wire bonds for outputting signals from the sensor.
18 . The method according to claim 12 , wherein the sensor is formed as a pressure sensor.
19 . The method according to claim 12 , wherein bonding the MEMS device to the pedestal mount comprises direct bonding.
20 . The method according to claim 12 , wherein bonding the MEMS device to the pedestal mount comprises adhesive bonding.