IP Library Granted Patent US 7,535,949
Granted Patent B2
US 7,535,949 · App. 11/684,375 · Granted May 19, 2009

VCSEL with integrated lens

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Quick Facts
Patent No.
US 7,535,949
App. No.
11/684,375
Granted
May 19, 2009
Kind
B2
Abstract

A wafer-level device fabrication process forms standing structures around emitting areas of multiple VCSELs. The standing structures can be shaped to hold ball lenses or other optical elements for respective VCSELs or can include platforms on which optical elements are formed. Ball lenses that are attached to the standing structures either during chip-level or wafer-level processes fit into the standing structures and are automatically aligned. Wafer level fabrication of optical elements can align the optical elements with accuracies associated with photolithographic processes. The optical elements can be formed using a molding or replication process, a printing method, or surface tension during a reflow of lithographically formed regions.

Claims (20)

1. A device comprising:

a substrate containing a laser diode;

a standing structure attached to the substrate, wherein the standing structure comprises

a standoff comprising at least one pillar attached to the substrate, and

a plate on which the lens resides, the plate being supported by the at least one pillar; and

a lens formed on the standing structure and overlying an emitting area through which a beam from the laser diode emerges from the substrate.

2. The device of claim 1 , further comprising:

a plurality of laser diodes in the substrate, and

a plurality of standing structures attached to the substrate; and

a plurality of lenses formed on the standing structures, each of the lenses overlying an emitting area through which a beam from a corresponding one of the laser diode emerges from the substrate.

3. The device of claim 1 , wherein the substrate comprises a die cut from a wafer.

4. The device of claim 1 , wherein the plate comprises a plate of a first material and the at least one pillar comprises at least one pillar of a second material.

5. The device of claim 4 , wherein the first material is glass, and the second material is a polymer.

6. The device of claim 1 , wherein the platform and the standoff are portions of a unified structure and formed of a common material.

7. The device of claim 1 , wherein the standing structure provides an air gap between the emitting area of the laser diode and the platform.

8. The device of claim 1 , wherein the standing structure comprises a pillar formed on the emitting area of the laser diode, and the platform comprises a top surface of the pillar.

9. The device of claim 1 , wherein the lens has an optical surface shaped by molding.

10. The device of claim 1 , wherein the lens has an optical surface shaped when material in the lens was liquid.

11. The device of claim 10 , wherein the lens element comprises a material cured through exposure to UV light.

12. The device of claim 11 , further comprising an optical fiber positioned to receive the beam from the laser diode after the lens focuses the beam.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2020
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
To: BROADCOM INTERNATIONAL PTE. LTD.
Reel/Frame 053771/0901 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF MERGER PREVIOUSLY RECORDED AT REEL: 047195 FRAME: 0827. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Nov 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047924/0571 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047195/0827 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →