Display device comprising a protective fixing member disposed only about a periphery of a semiconductor chip wherein a top side and a bottom side are co-planar with a respective top side and a bottom side of the semiconductor chip

1. A display device comprising:

a first substrate with a pixel switch and drivers mounted thereon;

a second substrate disposed in facing relation to said first substrate;

a material layer held between said first substrate and said second substrate and having peripheral edges sealed by a seal member, said material layer having an electrooptical effect;

a semiconductor chip mounted as a chip on glass (COG) component on said first substrate, said semiconductor chip having a control system configured to control said drivers;

an organic light-emitting diode (OLED) backlight illuminating said first substrate from a rear side of said first substrate through a diffusion sheet; and

a protective fixing member disposed on said first substrate only about a periphery of the semiconductor chip in a uniform manner so that a top side and a bottom side of the protective fixing member are co-planar with a respective top side and a bottom side of the semiconductor chip, the protective fixing member serving to fix the first substrate to the semiconductor chip and seal about the periphery of the semiconductor chip;

wherein,

said semiconductor chip has a thickness greater than a thickness of the seal member, and the thickness of the semiconductor chip is equal to or less than a total thickness of said seal member and said second substrate,

each of said semiconductor chip and said second substrate includes a polished surface.

2. The display device according to claim 1 , wherein the protective fixing member is at least in part between the semiconductor chip and the seal member, the protective fixing member secures the semiconductor chip to the first substrate, prevents moisture and mobile ions from entering the semiconductor chip, and prevents horizontal and vertical displacement of the semiconductor chip.

3. A display device comprising:

a first substrate with a pixel switch and drivers mounted thereon;

a second substrate disposed in facing relation to said first substrate;

a material layer held between said first substrate and said second substrate and having peripheral edges sealed by a seal member, said material layer having an electrooptical effect;

a semiconductor chip mounted as a chip on glass (COG) component on said first substrate, said semiconductor chip having a control system configured to control said drivers;

a protective fixing member disposed on at least a portion of said first substrate only laterally of said semiconductor chip in a uniform manner so that a top side and a bottom side of the protective fixing member are co-planar with a respective top side and a bottom side of the semiconductor chip, the protective fixing member serving to fix the first substrate to the semiconductor chip and seal about a periphery of the semiconductor chip;

an organic light-emitting diode (OLED) backlight illuminating said first substrate from a rear side of said first substrate through a diffusion sheet,

wherein,

said semiconductor chip has a thickness equal to or smaller than the distance from a surface of said first substrate which faces said material layer to a surface of said second substrate which faces away from said material layer, and

each of said semiconductor chip and said second substrate includes a polished surface.

4. A display device comprising:

a first substrate with a pixel switch and drivers mounted thereon;

a second substrate disposed in facing relation to said first substrate;

a material layer held between said first substrate and said second substrate and having peripheral edges sealed by a seal member, said material layer having an electrooptical effect;

a polarizing plate and phase difference plate combination disposed on said second substrate remotely from said material layer;

a semiconductor chip mounted as a chip on glass (COG) component on said first substrate, said semiconductor chip having a control system configured to control said drivers;

a protective fixing member disposed only around a periphery of the COG component in a uniform manner between the COG component and the seal member on the first substrate so that a top side and a bottom side of the protective fixing member are co-planar with a respective top side and a bottom side of the COG component, the protective fixing member serving to fix the first substrate to the COG component and seal the periphery of the semiconductor chip; and

an organic light-emitting diode (OLED) backlight illuminating said first substrate from a rear side of said first substrate through a diffusion sheet,

wherein,

said semiconductor chip has a thickness smaller than the total thickness of said seal member, said second substrate, and said polarizing plate and phase difference plate combination, and

at least said semiconductor chip includes a polished surface.

5. The display device according to claim 4 , wherein said semiconductor chip has a thickness equal to or smaller than at least the total thickness of said seal member and said second substrate and the thickness of said semiconductor chip is greater than a thickness of said seal member.

6. The display device according to claim 4 , wherein the protective fixing member prevents the COG component from being displaced horizontally or vertically.

7. The display device according to claim 5 , wherein the protective fixing member prevents moisture and mobile ions from entering the COG component.

8. The electronic apparatus having a display device, said display device comprising:

a first substrate with a pixel switch and drivers mounted thereon;

a second substrate disposed in facing relation to said first substrate;

a material layer held between said first substrate and said second substrate and having peripheral edges sealed by a seal member, said material layer having an electrooptical effect;

a semiconductor chip mounted as a chip on glass (COG) component on said first substrate, said semiconductor chip having a control system configured to control said drivers;

a protective fixing member disposed on said first substrate only laterally around the semiconductor chip in a uniform manner so that a top side and a bottom side of the protective fixing member are co-planar with a respective top side and a bottom side of the semiconductor chip, the protective fixing member serving to fix the semiconductor chip to the first substrate and provide a seal about a periphery of the semiconductor chip; and

an organic light-emitting diode (OLED) backlight illuminating said first substrate from a rear side of said first substrate through a diffusion sheet; and

wherein,

said semiconductor chip has a thickness greater than a thickness of the seal member, and the thickness of the semiconductor chip is equal to or less than a total thickness of said seal member and said second substrate; and

each of said semiconductor chip and said second substrate includes a polished surface.

9. The electronic apparatus having a display device, said display device comprising:

a first substrate with a pixel switch and drivers mounted thereon;

a second substrate disposed in facing relation to said first substrate;

a material layer held between said first substrate and said second substrate and having peripheral edges sealed by a seal member, said material layer having an electrooptical effect;

a polarizing plate and phase difference plate combination disposed on said second substrate remotely from said material layer;

a semiconductor chip mounted as a chip on glass (COG) component on said first substrate, said semiconductor chip having a control system configured to control said drivers;

a protective fixing member disposed only laterally around the COG component in a uniform manner between the COG component and the seal member on the first substrate so that a top side and a bottom side of the protective fixing member are co-planar with a respective top side and a bottom side of the COG component, the protective fixing member serving to fix the first substrate to the semiconductor chip and seal about a periphery of the semiconductor chip; and

an organic light-emitting diode (OLED) backlight illuminating said first substrate from a rear side of said first substrate through a diffusion sheet,

wherein,

said semiconductor chip has a thickness smaller than the total thickness of said seal member, said second substrate, and said polarizing plate and phase difference plate combination, and

at least said semiconductor chip includes a polished surface.

10. The display device according to claim 1 , further comprising:

a polarizing plate and phase difference plate combination disposed on said second substrate remotely from said material layer, wherein said thickness and said total thickness are 60 μm.

11. The display device according to claim 1 , wherein an outer surface of the OLED backlight is covered by a protective film.

12. The display device according to claim 3 , wherein an outer surface of the OLED backlight is covered by a protective film.

13. The display device according to claim 1 , wherein said protective fixing member is disposed around the semiconductor chip including between the semiconductor chip and a combination of said second substrate and said seal member, wherein the protective fixing member is selected from the group consisting of:

silicon resin, polyimide resin, and ultraviolet curable resin.

14. The display device according to claim 3 , wherein the thickness of said semiconductor chip is greater than a thickness of said seal member, and said protective fixing member is disposed around the semiconductor chip including between the semiconductor chip and a combination of said second substrate and said seal member, wherein the protective fixing member is selected from the group consisting of:

silicon resin, polyimide resin, and ultraviolet curable resin.

15. The display device according to claim 4 , wherein he protective fixing member is selected from the group consisting of:

silicon resin, polyimide resin, and ultraviolet curable resin.

16. The display device according to claim 8 , wherein protective fixing member is disposed only around the semiconductor chip including between the semiconductor chip and a combination of said second substrate and said seal member, wherein the protective fixing member is selected from the group consisting of:

silicon resin, polyimide resin, and ultraviolet curable resin.

17. The display device according to claim 9 , wherein the protective fixing member is selected from the group consisting of:

silicon resin, polyimide resin, and ultraviolet curable resin.

18. The display device according to claim 4 , wherein said thickness and said total thickness are either 60 or 80 μm.