Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same
View Patent ↗A blank and a semiconductor device are include a composite panel with semiconductor chips embedded in a plastic package molding compound. The blank includes a composite panel with semiconductor chips arranged in rows and columns in a plastic package molding compound with active upper sides of the semiconductor chips forming a coplanar surface area with the upper side of the composite panel. The blank further includes an orientation indicator impressed into the plastic package molding compound when the semiconductor chips are embedded within the molding compound.
1. A blank comprising:
a composite panel including at least one orientation indicator disposed on the composite panel; and
a plurality of semiconductor chips arranged in semiconductor device positions in rows and columns along the composite panel, wherein each of the semiconductor chips includes an active upper side, a rear side and edge sides, and the active upper sides of the semiconductor chips are substantially coplanar with an upper side of the composite panel;
wherein the composite panel comprises a plastic package molding compound in which at least the edge and rear sides of the semiconductor chips are embedded, and the plastic package molding compound includes the at least one orientation indicator, wherein the at least one orientation indicator comprises a cut-out section at a portion of the plastic package molding compound having a constant thickness such that the plastic package molding compound including the cut-out section has a single height between opposing upper and lower sides of the plastic package molding compound, and the at least one orientation indicator is asymmetrically disposed on the blank to facilitate a determination of a plurality of different orientations of the blank via the at least one orientation indicator.
2. The blank of claim 1 , wherein the blank has substantially the form and dimensions of a semiconductor wafer.
3. The blank of claim 1 , wherein the at least one orientation indicator comprises a beveled corner portion of the blank.
4. The blank of claim 1 , wherein the blank is substantially rectangular.
5. The blank of claim 1 , wherein the orientation indicator comprises a notch located at an edge portion of the blank.
6. A mold for embedding semiconductor devices into a plastic package molding compound, the mold comprising at least one mold cavity including a recess or elevation, wherein the recess or elevation is configured to impress an orientation indicator into the plastic package molding compound when a plurality of semiconductor devices are embedded within the plastic package molding compound by the mold, wherein active upper sides of the semiconductor devices are substantially coplanar with an upper side of the plastic package molding compound, wherein the mold forms the at least one orientation indicator such that:
the at least one orientation indicator comprises a cut-out section at a portion of the plastic package molding compound having a constant thickness and the plastic package molding compound including the cut-out section has a single height between opposing upper and lower sides of the plastic package molding compound; and
the at least one orientation indicator is asymmetrically disposed on the plastic package molding compound to facilitate a determination of a plurality of different orientations of the plastic package molding compound via the at least one orientation indicator.
7. The blank of claim 1 , wherein the active upper sides of the semiconductor chips and the upper side of the composite panel are exposed and not in contact with any other surface.
8. The blank of claim 1 , wherein the orientation indicator comprises a notch located along a side portion and between two corner portions of the blank.
9. The blank of claim 8 , wherein the orientation indicator further comprises a beveled corner portion of the blank.