IP Library Granted Patent US 7,838,589
Granted Patent B2
US 7,838,589 · App. 11/686,487 · Granted Nov 23, 2010

Sealant material

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Quick Facts
Patent No.
US 7,838,589
App. No.
11/686,487
Granted
Nov 23, 2010
Kind
B2
Abstract

There is disclosed a sealant material for providing sealing to a substrate and preferably an interface. The sealant material may also include a material, shape, ingredient or otherwise for inhibiting the flow of bubbles throught the material.

Claims (57)

1. A sealant material comprising:

a. an acrylate copolymer from about 30% to about 70% by weight of the sealant material;

b. an acetate copolymer from about 1% to about 10% by weight of the sealant material;

c. an epoxy resin from about 2% to about 50% by weight of the sealant material;

d. masses of blocking material;

e. one or more curing agents from about 0.0% to about 7% by weight of the sealant material; and

f. one or more fillers from about 5% to about 60% by weight of;

wherein the sealant material is capable of flowing and the masses for blocking material are capable of preventing bubbles from penetrating through the sealant material to an outwardly facing surface of the sealant material; and

wherein the acrylate copolymer is ethylene methacrylate copolymer with ethlene methyl acrylate copolymer.

2. The sealant material of claim 1 , wherein the acetate copolymer is ethylene vinyl acetate copolymer.

3. The sealant material of claim 2 , wherein the epoxy resin includes Bisphenol-A.

4. The sealant material of claim 1 , wherein the masses for blocking bubbles are formed at least partially of polyethyleneterephthalate, polyamides, glass, porous glass, ceramic, nanocomposites, nanoparticles, carbon black, feathers, or any combination thereof.

5. The sealant material of claim 1 , wherein the one or more curing agents is present in a range of about 0.0% to about 4% by weight of the sealant material.

6. The sealant material of claim 5 , wherein the one or more curing agents includes bis(t-butylperoxy)diisopropylbenzene, 1,1-di-t-butylperoxy-3,3,5-trimethylcyclohexane, 4,4-di-t-butylperoxy n-butyl valerate, dicumyl peroxide, triethylenetetramine, diethylenetriamine tetraethylenepentamine, cyanoguanidine, or any combination thereof.

7. The sealant material of claim 6 , wherein the one or more curing agents includes about 0.05% to about 2.0% by weight of a first curing agent having 4,4-di-t-butylperoxy n-butyl valerate or dicumyl peroxide, and about 0.01% to about 2.0% by weight of a second curing agent having cyanoguanidine.

8. The sealant material of claim 1 , wherein the one or more fillers includes calcium carbonate, sodium carbonate, mica, or a combination thereof.

9. The sealant material of claim 1 , wherein the sealant material further comprises:

i) an acrylate coagent;

ii) an accelerator for the one or more curing agents that includes a dimethyl urea;

iii) an adhesion promoter that includes an aliphatic hydrocarbon resin;

iv) an epoxy/elastomer adduct that includes about 1:5 to 5:1 parts of epoxy to elastomer; or

v) any combination thereof.

10. The sealant material of claim 1 , wherein the masses of blocking material remain substantially solid during flow of the sealant material such that bubbles or air cannot penetrate to the masses of blocking material.

11. The sealant material of claim 1 , wherein the sealant material has a melt temperature that ranges from about 65° C. to about 140° C.

12. The sealant material of claim 1 , wherein the sealant material has a glass transition temperature that ranges from about 0.0° C. to about -60° C.

13. The sealant material of claim 1 , wherein the sealant material has a curing temperature that ranges from about 120° C. to about 170° C.

14. The sealant material of claim 1 , wherein the sealant material has a curing temperature that ranges from about 170° C. to about 200° C.

15. A sealant material comprising:

a. an acrylate copolymer from about 45% to about 60% by weight of the sealant material;

b. an acetate copolymer from about 2% to about 6% by weight of the sealant material;

c. an epoxy resin from about 5% to about 30% by weight of the sealant material;

d. masses of blocking material, the masses for blocking material are formed at least partially of polyethyleneterephthalate, polyamides, glass, porous glass, ceramic, nanocomposites, nanoparticles, carbon black, feathers, or any combination thereof;

e. one or more filler from about 20% to about 45% by weight of the sealant material; and f. one or more curing agents from about 0.0% to about 7% by weight of the sealant material;

wherein the masses of blocking material are formed as a layer over a surface of an activatable portion of the sealant material;

wherein the sealant material is capable of flowing and the masses for blocking material are capable of preventing bubbles from penetrating through the sealant material to an outwardly facing surface of the sealant material; and

wherein the masses of blocking material remain substantially solid during flow of the sealant material such that bubbles or air cannot penetrate to the masses of blocking material.

16. The sealant material of claim 15 , wherein:

i) the epoxy resin includes Bisphenol-A;

ii) the one or more fillers includes calcium carbonate, sodium carbonate, mica, or a combination thereof;

iii) the one or more curing agents includes bis(t-butylperoxy)diisopropylbenzene, 1,1-di-t-butylperoxy-3,3,5-trimethylcyclohexane, 4,4-di-t-butylperoxy n-butyl valerate, dicumyl peroxide, triethylenetetramine, diethylenetriamine tetraethylenepentamine, cyanoguanidine, or any combination thereof;

iv) the sealant material further includes an acrylate coagent; and

v) the sealant material further includes an accelerator for the one or more curing agents that includes a dimethyl urea, an adhesion promoter that includes an aliphatic hydrocarbon resin, or a combination of both.

17. The sealant material of claim 16 , wherein the sealant material has a curing temperature that ranges from about 120° C. to about 135° C.

18. The sealant material of claim 16 , wherein the sealant material has a curing temperature that ranges from about 170° C. to about 195° C.

19. A sealant material comprising:

a. an ethylene methyl acrylate copolymer from about 45% to about 60% by weight of the sealant material;

b. an ethylene methyl acrylate copolymer from about 2% to about 6% by weight of the sealant material;

c. an epoxy resin that includes Bisphenol-A from about 5% to about 15% by weight of the sealant material;

d. masses of blocking material that are formed at least partially of polyethyleneterephthalate;

e. one or more fillers that include calcium carbonate from about 20% to about 40% by weight of the sealant material;

f. one or more curing agents that include 4,4-di-t-butylperoxy n-butyl valerate or dicumyl peroxide from about 0.0% to about 5% by weight of the sealant material and cyanoguanidine;

g. an acrylate coagent;

h. an accelerator for the one or more curing agents that includes a dimethyl urea, an adhesion promoter that includes an aliphatic hydrocarbon resin or a combination of both;

wherein the masses of blocking material are formed as a layer over a surface of an activatable portion of the sealant material;

wherein the sealant material is capable of flowing and the masses for blocking material are capable of preventing bubbles from penetrating through the sealant material to an outwardly facing surface of the sealant material; and

wherein the masses of blocking material remain substantially solid during flow of the sealant material such that bubbles or air cannot penetrate to the masses of blocking material.

20. The sealant material of claim 19 , wherein the sealant material has a curing temperature that ranges from about 120° C. to about 135° C. or from about 170° C. to about 195° C.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 3, 2007
From: FINERMAN, TERRY; KASSA, ABRAHAM
To: ZEPHYROS, INC.
Reel/Frame 019243/0554 →