Energy scavenger and method for manufacturing the same
View Patent ↗A micro-electromechanical package includes a casing and a microelectronic circuit. At least one portion of the casing includes a piezoelectric material arranged such that, in use, dynamically changing mechanical strain in the at least one portion produces an electrical charge usable as a power source by the microelectronic circuit.
1. A micro-electromechanical (MEMS) package, comprising:
a casing, wherein at least one outer wall of the casing comprises piezoelectric material arranged such that dynamically changing mechanical strain in the at least one outer wall produces an electrical charge; and
a microelectronic circuit enclosed within the casing, the microelectronic circuit being configured to receive and be powered by the electrical charge.
2. The micro-electromechanical package of claim 1 , wherein the microelectronic circuit is mounted on the at least one outer wall of the casing.
3. The micro-electromechanical package of claim 2 , wherein the at least one outer wall of the casing comprises an inertial mass formed as part of the casing.
4. The micro-electromechanical package of claim 1 , wherein the piezoelectric material comprises embedded electrode layers configured to collect the electrical charge produced by the piezoelectric material.
5. The micro-electromechanical package of claim 1 , wherein the casing comprises Aluminum Nitride.
6. The micro-electromechanical package of claim 1 , wherein the microelectronic circuit comprises at least one of: a power management circuit, a power storage circuit, and a micro-electromechanical sensor circuit.
7. A method of manufacturing a micro-electromechanical (MEMS) package, comprising:
providing a casing, wherein at least one outer wall of the casing includes a piezoelectric material arranged such that dynamically changing mechanical strain in the at least one outer wall produces an electrical charge;
providing a microelectronic circuit enclosed within the casing, the microelectronic circuit being configured to receive and be powered by the electrical charge; and
forming the MEMS package via a ceramic multi-layering technique or a polymer molding technique.
8. The method of claim 7 , wherein the microelectronic circuit is mounted on the at least one outer wall of the casing.
9. The method of claim 8 , wherein the at least one outer wall is formed to include an inertial mass formed as part of the casing.
10. The method of claim 7 , wherein the piezoelectric material comprises embedded electrode layers configured to collect the electrical charges produced by the piezoelectric material.
11. The method of claim 7 , wherein the casing is formed to include Aluminum Nitride.
12. The method of claim 7 , wherein the microelectronic circuit is formed to include at least one of: a power management circuit; a power storage circuit; and a micro-electromechanical sensor circuit.
13. The micro-electromechanical package of claim 1 , wherein the at least one outer wall of the casing comprises an inertial mass formed as part of the casing.