Use of predictive pulse triggering to improve accuracy in link processing
View Patent ↗A predictive pulse triggering (PPT) method enables precise triggering of a laser beam in a link-processing system. The PPT method entails triggering the laser beam based on estimated relative motion parameters of the target and laser beam axis. The PPT method allows for a six-fold improvement in laser positioning accuracy over the conventional, entirely measurement-based method.
1. A method of triggering emission of laser pulses directed for processing a target specimen, the laser pulses propagating along a beam axis and the target specimen mounted to a support, the beam axis and support moving relative to each other at a velocity to process the target specimen by incidence of the laser pulses at specified target specimen locations, and the specified target specimen locations being associated with laser pulse trigger positions on the target specimen, comprising:
performing, at multiple time-displaced measurement intervals corresponding to a measurements sampling rate, measurements of relative positions between the beam axis and the support to acquire measured relative position data;
estimating relative position data for different times within each of the multiple time-displaced measurement intervals, the estimated relative position data corresponding to extrapolated relative positions between the beam axis and the support at the different times corresponding to an extrapolated position data sampling rate that is substantially greater than the measurements sampling rate, and, for each of the multiple time-displaced measurement intervals, the extrapolated relative positions being derived from values of the measured relative position data, velocity, and time elapsed within the time-displaced measurement interval;
comparing the estimated relative position data with the laser pulse trigger positions associated with the specified target specimen locations to determine occurrence of the beam axis within a trigger window associated with a selected one of the specified target specimen locations; establishing the trigger window in accordance with a ratio of the measurements sampling rate to the extrapolated position data sampling rate; and
in response to the determination of the occurrence of the beam axis within the trigger window, triggering emission of a laser pulse to process the target specimen at the selected one of the specified target specimen locations.
2. The method of claim 1 , in which the velocity includes a measured velocity value corresponding to one of the relative positions between the beam axis and the support.
3. The method of claim 1 , in which the velocity includes a commanded set-point velocity of the relative movement of the beam axis and the support.
4. The method of claim 1 , in which the velocity includes an estimate based on the relative movement of the beam axis and the support.
5. The method of claim 1 , in which the measurements of relative positions performed at multiple time-displaced measurement intervals are provided by an interferometer.
6. The method of claim 1 , in which the measurements of relative positions performed at multiple time-displaced measurement intervals are provided by an encoder.
7. The method of claim 1 , in which the estimating of relative position data is performed with use of a Kalman filter.
8. The method of claim 1 , in which the estimating of relative position data is performed by link processing (LIP) circuitry.
9. The method of claim 1 , in which the estimating of relative position data corresponding to extrapolated relative positions comprises using the velocity to compute incremental position values in smaller time intervals than the multiple time-displaced measurement intervals.
10. The method of claim 1 , in which the values of the relative position data from which the extrapolated relative positions are derived correspond to a number of previous multiple time-displaced measurement intervals.
11. The method of claim 1 , in which the support includes a motion stage.
12. The method of claim 1 , in which the target specimen includes a semiconductor wafer fabricated with electrically conducting link structures.
13. The method of claim 1 , in which the trigger window represents a trigger time window, and in which the triggering of emission of a laser pulse takes place at a time within the trigger time window.
14. The method of claim 1 , in which the trigger window represents a trigger position window, and in which the triggering of emission of a laser pulse takes place upon the occurrence of the beam axis within the trigger position window.