Etching apparatus for substrates
View Patent ↗An etching apparatus for substrates includes an etching tank including an etching solution, a cassette having a plurality of substrates mounted therein and which is installed inside the etching tank, a porous plate installed on a lower surface of the cassette and a plurality of discharge sections provided in the porous plate corresponding to the substrates and each of the discharge sections having a plurality of discharge ports. The etching apparatus further includes a plurality of first lines connected to the discharge ports respectively, and supplied with a gas to provide bubbles to the substrates through the discharge ports. The first lines are divided into a plurality of groups, and at least one group is supplied with a gas having a pressure different from a pressure of a gas supplied to other groups.
1. An etching apparatus for substrates comprising:
an etching tank including an etching solution;
a cassette having a plurality of substrates mounted therein and the cassette is installed inside the etching tank;
a porous plate installed on a lower surface of the cassette; a plurality of discharge sections provided in the porous plate corresponding to the substrates, in which each of the discharge sections includes a plurality of discharge ports; and
a plurality of first lines connected to the discharge ports, respectively, and supplied with a gas to provide bubbles to the substrates through the discharge ports,
wherein the first lines are divided into a plurality of groups; and
a plurality of second lines connected to the plurality of groups, respectively and wherein the plurality of second lines are adapted to supply at least one group with a gas having a pressure different from a pressure of a gas supplied to other groups.
2. The etching apparatus of claim 1 , wherein the plurality of second lines connected to the plurality of groups, supply a same pressure of gas to the first lines belonging to a same group.
3. The etching apparatus of claim 1 , wherein the first lines belonging to a same group are connected to at least one discharge port belonging to a same discharge section.
4. The etching apparatus of claim 1 , wherein the first lines belonging to a same group are connected to at least two discharge ports belonging to different discharge sections.
5. The etching apparatus of claim 1 , wherein the first lines belonging to each group are different in number.
6. The etching apparatus of claim 1 , wherein the second lines further include pressure regulators, respectively.
7. The etching apparatus of claim 1 , wherein the first lines are directly connected with the discharge ports.
8. The etching apparatus of claim 1 , wherein the discharge ports belonging to a same discharge section are aligned in parallel to a length direction of a bottom surface of a substrate corresponding to the same discharge section.
9. The etching apparatus of claim 8 , wherein the discharge sections are interposed between the substrates.
10. The etching apparatus of claim 1 , wherein the discharge ports belonging to each discharge section are disposed on opposite sides of each substrate on a basis of a bottom surface of the substrate corresponding to the each discharge section when viewed from a top of the etching tank.
11. The etching apparatus of claim 10 , wherein the discharge ports are disposed on opposite sides of the substrate in a zigzag manner.
12. An etching apparatus for substrates comprising: an etching tank including an etching solution;
a cassette having a plurality of substrates mounted therein and the cassette is installed inside the etching tank;
a plurality of partitions provided in the cassette and separating the substrates from each other;
a porous plate installed on a lower surface of the cassette;
a plurality of discharge sections provided in the porous plate corresponding to the substrates, in which each of the discharge sections has a plurality of discharge ports; and
a plurality of first lines connected to the discharge ports, respectively, and supplied with a gas to provide bubbles to the substrates through the discharge ports,
wherein the first lines are divided into a plurality of groups; and
a plurality of second lines connected to the plurality of groups, respectively and wherein the plurality of second lines are adapted to supply at least one group with a gas having a pressure different from a pressure of a gas supplied to other groups.
13. The etching apparatus of claim 12 , wherein the plurality of second lines connected to the plurality of groups, respectively, so as to supply a same pressure of a gas to the first lines.
14. The etching apparatus of claim 12 , wherein the first lines belonging to a same group are connected to at least one discharge port belonging to a same discharge section.
15. The etching apparatus of claim 12 , wherein the first lines belonging to a same group are connected to at least two discharge ports belonging to different discharge sections.
16. The etching apparatus of claim 12 , wherein the discharge ports belonging to a same discharge section are aligned in parallel to a length direction of a bottom surface of the substrate corresponding to the same discharge section.
17. The etching apparatus of claim 12 , wherein the discharge ports belonging to each discharge section are disposed on opposite sides of each substrate on a basis of a bottom surface of the substrate corresponding to the each discharge section when viewed from a top of the etching tank.
18. The etching apparatus of claim 12 , wherein at least one of the substrates is disposed between the partitions.
19. The etching apparatus of claim 18 , wherein each of the partitions has a size that is equal to or greater than a size of each of the substrates.