IP Library Patent Application 11689228
Patent Application
App. No. 11/689,228

Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof

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Patent No.
US None
App. No.
11/689,228
Abstract

Disclosed herein is a moldable composition, comprising an organic polymer; a filler composition comprising graphite; and boron nitride, wherein the moldable composition has an electrical resistivity greater than or equal to about 10 13 ohm/sq, wherein the moldable composition has a melt flow index of about 1 to about 30 grams per 10 minutes when measured at a temperature of 280° C. under a load of 16 kgf/cm 2 . Disclosed herein too is a moldable composition, comprising about 30 to about 85 wt % of an organic polymer; a filler composition, comprising about 10 to about 70 wt % graphite; about 5 to about 60 wt % boron nitride; wherein the moldable composition has a thermal conductivity of about 2 to about 6 Watts per meter-Kelvin; and an electrical resistivity greater than or equal to about 10 13 ohm/sq.

Claims (29)

1 . A moldable composition, comprising:

an organic polymer;

a filler composition comprising:

graphite; and

boron nitride, wherein the moldable composition has an electrical resistivity greater than or equal to about 10 13 ohm/sq, wherein the moldable composition has a melt flow index of about 1 to about 30 grams per 10 minutes when measured at a temperature of 280° C. under a load of 16 kgf/cm 2 .

2 . The moldable composition of claim 1 , having a thermal conductivity of about 2 W/m-K to about 6 W/m-K.

3 . The moldable composition of claim 1 , having a Class A surface finish.

4 . The moldable composition of claim 1 , wherein the organic polymer is a thermoplastic resin, a blend of thermoplastic resins, a thermosetting resin, a blend of thermosetting resins, a blend of thermoplastic resins with thermosetting resins, a copolymer, a terpolymer, an oligomer, a homopolymer, a block copolymer, an alternating block copolymer, a random copolymer, a random block copolymer, a graft copolymer, a star block copolymer, a dendrimer, or a combination comprising at least one of the foregoing organic polymers.

5 . The moldable composition of claim 1 , wherein said organic polymer is a polyacetal, a polyolefin, a polyacrylic, a polycarbonate, a polystyrene, a polyester, a polyamide, a polyamideimide, a polyarylate, a polyarylsulfone, a polyethersulfone, a polyphenylene sulfide, a polyvinyl chloride, a polysulfone, a polyimide, a polyetherimide, a polytetrafluoroethylene, a polyetherketone, a polyether etherketone, a polyether ketone ketone, a polybenzoxazole, a polyphthalide, a polyacetal, a polyanhydride, a polyvinyl ether, a polyvinyl thioether, a polyvinyl alcohol, a polyvinyl ketone, a polyvinyl halide, a polyvinyl nitrile, a polyvinyl ester, polysulfonate, a polysulfide, a polythioester, a polysulfone, a polysulfonamide, polyurea, a polyphosphazene, a polysilazane, a styrene acrylonitrile, a acrylonitrile-butadiene-styrene, or a combination comprising at least one of the foregoing polymers.

6 . The moldable composition of claim 1 , wherein the organic polymer is a thermosetting resin and wherein the thermosetting resins are polyurethanes, natural rubbers, synthetic rubbers, epoxies, phenolics, silicones, or a combination comprising at least one of the foregoing polymers.

7 . The moldable composition of claim 1 , wherein the graphite is a crystal vein graphite, a flake graphite, an amorphous graphite, a synthetic graphite, or a combination comprising at least one of the foregoing graphites.

8 . The moldable composition of claim 7 , wherein the graphite has a particle size of about 1 to about 5000 micrometers.

9 . The moldable composition of claim 1 , wherein the graphite is present in an amount of 10 wt % to about 30 wt % based on the weight of the moldable composition.

10 . The moldable composition of claim 1 , wherein the boron nitride is a cubic boron nitride, a hexagonal boron nitride, an amorphous boron nitride, a rhombohedral boron nitride, or a combination comprising at least one of the boron nitrides.

11 . The moldable composition of claim 10 , wherein the boron nitride has a particle size of about 1 to about 5,000 micrometers.

12 . The moldable composition of claim 1 , wherein the boron nitride is present in an amount of 5 wt % to about 60 wt % based on the weight of the moldable composition.

13 . A moldable composition, comprising:

about 30 to about 85 wt % of an organic polymer composition; and

a filler composition, comprising:

about 10 to about 30 wt % graphite;

about 5 to about 60 wt % boron nitride; wherein all weights are based on the weight of the moldable composition; wherein the moldable composition has a thermal conductivity of about 2 to about 6 Watts per meter-Kelvin and an electrical resistivity greater than or equal to about 10 13 ohm/sq.

14 . The moldable composition of claim 13 , wherein the melt flow index is about 1 to about 30 grams per 10 minutes when measured at a temperature of 280° C. under a load of 16 kg-f/cm 2 .

15 . A method of manufacturing a moldable composition comprising:

melt blending a moldable composition comprising an organic polymer; a filler composition comprising graphite; and boron nitride, wherein the moldable composition has an electrical resistivity greater than or equal to about 10 13 ohm/sq.

16 . The method of claim 15 , further comprising molding the moldable composition.

17 . The method of claim 15 , wherein the molding is injection molding.

18 . An article comprising the moldable composition of claim 1 .

19 . An article comprising the moldable composition of claim 15 .

20 . An article comprising the moldable composition of claim 17 .

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE 12/116841, 12/123274, 12/345155, 13/177651, 13/234682, 13/259855, 13/355684, 13/904372, 13/956615, 14/146802, 62/011336 PREVIOUSLY RECORDED ON REEL 033591 FRAME 0673. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded Aug 29, 2014
From: SABIC INNOVATIVE PLASTICS IP B.V.
To: SABIC GLOBAL TECHNOLOGIES B.V.
Reel/Frame 033663/0427 →
CORRECTIVE ASSIGNMENT TO CORRECT REMOVE 10 APPL. NUMBERS PREVIOUSLY RECORDED AT REEL: 033591 FRAME: 0673. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded Aug 28, 2014
From: SABIC INNOVATIVE PLASTICS IP B.V.
To: SABIC GLOBAL TECHNOLOGIES B.V.
Reel/Frame 033649/0529 →
CHANGE OF NAME Recorded Aug 22, 2014
From: SABIC INNOVATIVE PLASTICS IP B.V.
To: SABIC GLOBAL TECHNOLOGIES B.V.
Reel/Frame 033591/0673 →
RELEASE OF SECURITY INTEREST Recorded Mar 17, 2014
From: CITIBANK, N.A.
To: SABIC INNOVATIVE PLASTICS IP B.V.
Reel/Frame 032459/0798 →
SECURITY AGREEMENT Recorded Aug 18, 2008
From: SABIC INNOVATIVE PLASTICS IP B.V.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 021423/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2008
From: GENERAL ELECTRIC COMPANY
To: SABIC INNOVATIVE PLASTICS IP B.V.
Reel/Frame 020985/0551 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2007
From: CHARATI, SANJAY GURABASAPPA; GHOSH, SOUMYADEB; HR, MANJUNATH; SAAK, JENNIFER SU; TANDON, KUNJ
To: GENERAL ELECTRIC COMPANY
Reel/Frame 019043/0816 →