Grounding clip for grounding a printed circuit board in a transceiver module
View Patent ↗A transceiver module that utilizes an apparatus for providing chassis ground to a printed circuit board located within a connector structure of the transceiver module. In one example embodiment, a ground clip for use in a transceiver module includes a cross-arm, a pair of arms connected to the cross-arm, a pair of fingers each connected to one of the pair of arms, and at least one protrusion connected to the cross-arm. Each finger is configured to be inserted into a hole in a connector structure and configured to be electrically connected to ground contacts of a printed circuit board. The at least one protrusion is configured to bias against, and make reliable electrical contact with, a portion of a transceiver module that is electrically connected to a housing of the transceiver module.
1. A ground clip for use in a transceiver module, the ground clip comprising:
a cross-arm;
a pair of arms connected to the cross-arm;
a pair of fingers each connected to one of the pair of arms, each finger being configured to be inserted into a hole in a connector structure of the transceiver module and configured to be electrically connected to ground contacts of a printed circuit board that is at least partially positioned within the connector structure; and
at least one protrusion connected to the cross-arm, the at least one protrusion being configured to bias against and make reliable electrical contact with a portion of the transceiver module that is configured to be electrically connected to a chassis ground of a host device when the transceiver module is positioned in a port of the host device.
2. The ground clip as recited in claim 1 , wherein the cross arm and the pair of arms connected to the cross-arm form a substantially U-shaped component.
3. The ground clip as recited in claim 2 , wherein the pair of fingers generally extend toward one another.
4. The ground clip as recited in claim 1 , wherein the ground clip comprises stainless steel with nickel-gold plating.
5. A transceiver module for use in a communications network, the transceiver module comprising:
a housing configured to be electrically connected to a chassis ground of a host device when the transceiver module is positioned in a port of the host device;
a connector structure at least partially positioned within the housing;
a printed circuit board positioned within the connector structure, the printed circuit board including electronic circuitry; and
a ground clip at least partially surrounding the connector structure, the ground clip comprising:
a cross-arm;
a pair of arms connected to the cross-arm;
a pair of fingers each connected to one of the pair of arms, each finger extending into a corresponding hole in the connector structure and electrically connected to a ground contact of the printed circuit board; and
at least one protrusion connected to the cross-arm, the at least one protrusion biased against and in reliable electrical contact with the housing or a portion of the transceiver module that is electrically connected to the housing.
6. The transceiver module as recited in claim 5 , wherein a portion of the transceiver module that is configured to be positioned within a host port substantially conforms to the Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA).
7. The transceiver module as recited in claim 5 , wherein the transceiver module is configured to achieve data rates of about 1.25 Gb/s.
8. The transceiver module as recited in claim 5 , wherein the transceiver module substantially supports the 1000Base-T transmission standard.
9. The transceiver module as recited in claim 5 , wherein the transceiver module is configured to operate between about −40° C. and about 85° C.
10. The transceiver module as recited in claim 5 , wherein the portion of the transceiver module that is electrically connected to the housing comprises a latch mechanism attached to the housing, the latch mechanism configured to latch the transceiver module within a port of the host device.
11. The transceiver module as recited in claim 5 , wherein the fingers of the ground clip are soldered to the ground contacts of the printed circuit board.
12. The transceiver module as recited in claim 5 , wherein the connector structure defines grooves in which the arms of the ground clip are at least partially positioned.
13. The transceiver module as recited in claim 5 , wherein the electrical connection between the fingers of the ground clip and the ground contacts of the printed circuit board is also configured to substantially prevent vertical or horizontal displacement of the printed circuit board within the connector structure.
14. The transceiver module as recited in claim 5 , further comprising a plurality of electrical cores positioned within the connector structure proximate the printed circuit board.
15. The transceiver module as recited in claim 14 , wherein the printed circuit board is electrically connected to the plurality of electrical cores such that common mode noise from the plurality of electrical cores can transfer through the printed circuit board to the ground clip.
16. The transceiver module as recited in claim 5 , wherein the ground clip is configured to operate in conjunction with a common mode choke that is integrated into the electronic circuitry included in the printed circuit board.
17. A transceiver module comprising:
a housing comprising electrically conductive material;
a connector structure at least partially positioned within the housing;
a printed circuit board at least partially positioned within the connector structure;
a latch mechanism attached to and in electrical contact with the housing, the latch mechanism configured to latch the transceiver module within a port of a host device; and
a ground clip at least partially surrounding the connector structure and at least partially positioned within the housing, the ground clip comprising:
a first contact point electrically connected to a ground contact on the printed circuit board; and
a second contact point electrically connected to a portion of the latch mechanism.
18. The transceiver module as recited in claim 17 , wherein the first contact point of the ground clip comprises a finger that is inserted into a hole in the connector structure.
19. The transceiver module as recited in claim 18 , wherein the second contact point of the ground clip comprises a protrusion in electrical contact with the finger, the protrusion being biased against a mounting plate of the latch mechanism, the mounting plate being attached to and in electrical contact with the housing.
20. The transceiver module as recited in claim 18 , wherein the electrical contact between the finger of the ground clip and the ground contact of the printed circuit board is also configured to substantially prevent vertical or horizontal displacement of the printed circuit board within the connector structure.