IP Library Granted Patent US 7,387,538
Granted Patent B2
US 7,387,538 · App. 11/689,403 · Granted Jun 17, 2008

Connector structure for a transceiver module

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Quick Facts
Patent No.
US 7,387,538
App. No.
11/689,403
Granted
Jun 17, 2008
Kind
B2
Abstract

A transceiver module, such as a copper transceiver module, that utilizes an example connector structure for receiving the plug of a communication cable. The example connector structure is configured to house a plurality of electronic components in such a way as to efficiently utilize the space within the connector structure itself. In one example embodiment, a connector structure for use in a copper transceiver module includes a body, a first plurality of conductive elements attached to the body, and first and second cavities defined in the body. The first plurality of conductive elements is configured to electrically connect with a corresponding second plurality of electrical elements on a plug of a communications cable. A first plurality of electrical cores and a printed circuit board are positioned in the first cavity. A second plurality of electrical cores is positioned in the second cavity.

Claims (45)

1. A connector structure for use in a transceiver module, the connector structure comprising:

a body;

a first plurality of conductive elements attached to the body, the first plurality of conductive elements configured to electrically connect with a corresponding second plurality of electrical elements on a plug of a communications cable;

a first cavity defined in the body;

a first plurality of electrical cores positioned in the first cavity;

a second cavity defined in the body;

a second plurality of electrical cores positioned in the second cavity; and

a printed circuit board positioned within the first cavity.

2. The connector structure as recited in claim 1 , wherein the first plurality of electrical cores comprises four electrical cores.

3. The connector structure as recited in claim 1 , wherein the second plurality of electrical cores comprises four electrical cores.

4. The connector structure as recited in claim 1 , wherein the first plurality of electrical cores comprises eight electrical cores.

5. The connector structure as recited in claim 4 , wherein at least a portion of the printed circuit board is positioned between at least two of the eight electrical cores.

6. A connector structure for use in a transceiver module, the connector structure comprising:

a body;

a first plurality of conductive elements attached to the body;

a second plurality of conductive elements attached to the body;

a first cavity defined in the body;

a first plurality of electrical cores positioned in the first cavity;

a second cavity defined in the body;

a second plurality of electrical cores positioned in the second cavity; and

a printed circuit board positioned within the first cavity, wherein the first plurality of conductive elements is electrically coupled through the printed circuit board to the second plurality of conductive elements.

7. The connector structure as recited in claim 6 , wherein the first plurality of conductive elements are configured to electrically connect with corresponding electrical elements of an RJ-45 plug.

8. The connector structure as recited in claim 6 , wherein the second plurality of conductive elements are configured to electrically connect with corresponding electrical elements of a second printed circuit board.

9. The connector structure as recited in claim 6 , wherein the first plurality of electrical cores comprises eight electrical cores.

10. The connector structure as recited in claim 9 , wherein at least a portion of the printed circuit board is positioned between at least two of the eight electrical cores.

11. A transceiver module for use in a communications network, the transceiver module comprising:

a housing;

a base at least partially positioned within the housing; the base including a connector portion that is configured to remain substantially outside of a host port when the transceiver module is positioned within the host port; and

a connector structure, the connector structure comprising:

a body;

a first plurality of conductive elements attached to the body, the first plurality of conductive elements configured to electrically connect with a corresponding second plurality of electrical elements on a plug of a communications cable;

a first cavity defined in a first portion of the body, the first portion substantially positioned within the connector portion of the base;

a first plurality of electrical cores positioned within the first cavity; and

a printed circuit board positioned within the first cavity.

12. The transceiver module as recited in claim 11 , wherein a portion of the transceiver module that is configured to be positioned within a host port substantially conforms to the SFP Transceiver MSA.

13. The transceiver module as recited in claim 11 , wherein the transceiver module is configured to achieve data rates of about 1.25 Gb/s.

14. The transceiver module as recited in claim 11 , wherein the transceiver module substantially supports the 1000Base-T transmission standard.

15. The transceiver module as recited in claim 11 , wherein the transceiver module is configured to operate between about −40° C. and 85° C.

16. The transceiver module as recited in claim 11 , wherein the first plurality of electrical cores comprises four electrical cores.

17. The transceiver module as recited in claim 11 , wherein the first plurality of electrical cores comprises eight electrical cores.

18. The transceiver module as recited in claim 17 , wherein at least a portion of the printed circuit board is positioned between at least two of the eight electrical cores.

19. The transceiver module as recited in claim 11 , wherein the connector structure further comprises:

a second cavity defined in a second portion of the body, the second portion substantially positioned within the base; and

a second plurality of electrical cores positioned within the second cavity.

20. The transceiver module as recited in claim 19 , wherein the second plurality of electrical cores comprises four electrical cores.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2019
From: TOGAMI, CHRIS
To: FINISAR CORPORATION
Reel/Frame 049260/0555 →