IP Library Granted Patent US 7,589,801
Granted Patent B2
US 7,589,801 · App. 11/691,111 · Granted Sep 15, 2009

Liquid crystal display and method of manufacturing thereof

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Quick Facts
Patent No.
US 7,589,801
App. No.
11/691,111
Granted
Sep 15, 2009
Kind
B2
Abstract

A display device includes a thin film transistor (TFT) substrate, a countering substrate facing the TFT substrate, a sealant, and a liquid crystal layer interposed between the TFT substrate and the countering substrate. The TFT substrate includes a substrate having a display area and a peripheral area, a first TFT formed in the peripheral area and including a semiconductor layer and a resistive contact member formed on the semiconductor layer, a light blocking semiconductor pattern, a second TFT formed in the display area and including a gate electrode. The sealant couples the TFT substrate to the countering substrate, and covers the first TFT.

Claims (51)

1. A display device comprising:

a thin film transistor (TFT) substrate having a display area and a peripheral area surrounding the display area,

wherein the TFT substrate comprises:

a substrate;

a first TFT formed in the peripheral area, the first TFT including a semiconductor layer and a resistive contact member formed on the semiconductor layer;

a light blocking semiconductor pattern; and

a second TFT formed in the display area and including a gate electrode;

a countering substrate;

a sealant coupling the TFT substrate to the countering substrate, wherein the sealant covers the first TFT; and

a liquid crystal layer interposed between the TFT substrate and the countering substrate,

wherein the light blocking semiconductor pattern is formed adjacent to the first TFT and is formed from the same layer as the semiconductor layer.

2. The display device of claim 1 , further comprising a resistive contact pattern formed on the light blocking semiconductor pattern, wherein the resistive contact pattern is formed from the same layer as the resistive contact member.

3. The display device of claim 1 , wherein the first TFT comprises a source electrode and a drain electrode formed on the semiconductor layer.

4. The display device of claim 3 , wherein the first TFT further comprises a connection part connecting the drain electrode with a gate line.

5. The display device of claim 3 , wherein the source electrode and the drain electrode are spaced apart from the light blocking semiconductor layer by a predetermined distance, respectively.

6. The display device of claim 3 , further comprising:

a light blocking metal layer formed on the light blocking semiconductor pattern and comprising substantially the same material as the source electrode and the drain electrode.

7. The display device of claim 1 , wherein the light blocking semiconductor layer comprises at least one of hydrogenated amorphous silicon or crystalline silicon.

8. The display device of claim 1 , wherein the sealant covers at least a portion of the light blocking semiconductor pattern.

9. A method of manufacturing a display device comprising:

forming a thin film transistor (TFT) substrate having a display area and a peripheral area;

forming a first gate electrode in the display area and a second gate electrode in the peripheral area;

forming a semiconductor layer and a resistive contact member on the first gate electrode and the second gate electrode;

forming a first semiconductor layer and a first resistive contact member on the first gate electrode by patterning the resistive contact member and the semiconductor layer;

forming a light blocking semiconductor pattern and a resistive contact pattern in the peripheral area;

forming a conductive layer on the first resistive contact member;

forming a first source electrode and a first drain electrode by patterning the conductive layer; and

forming a sealant interposed between the TFT substrate and the countering substrate, wherein the sealant covers the first semiconductor layer.

10. The method of claim 9 , further comprising:

forming a second semiconductor layer and a second resistive contact member on the second gate electrode.

11. The method of claim 9 , further comprising:

forming a second source electrode and a second drain electrode on the second resistive contact member.

12. The method of claim 9 , further comprising:

forming a passivation layer having a first contact hole to expose the first drain electrode and a second contact hole to expose a gate line; and

forming connection part connecting the first drain electrode with the gate line on the passivation layer.

13. The method of claim 9 , wherein the first source electrode and the first drain electrode are spaced apart from the light blocking semiconductor pattern by predetermined distance.

14. The method of claim 9 , further comprising:

forming a light blocking metal layer on the light blocking semiconductor layer, the light blocking metal layer comprising substantially the same material as the source electrode and the drain electrode.

15. The method of claim 9 , wherein the light blocking semiconductor pattern comprises at least one of hydrogenated amorphous silicon or crystalline silicon.

16. The method of claim 9 , wherein the sealant covers at least a portion of the light blocking semiconductor pattern.

17. A display device comprising:

a thin film transistor (TFT) substrate having a display area and a peripheral area surrounding the display area,

wherein the TFT substrate comprises:

a substrate;

a first TFT formed in the peripheral area, the first TFT including a semiconductor layer and a resistive contact member formed on the semiconductor layer;

a light blocking semiconductor pattern; and

a second TFT formed in the display area and including a gate electrode;

a countering substrate;

a sealant coupling the TFT substrate to the countering substrate, wherein the sealant covers the first TFT;

a liquid crystal layer interposed between the TFT substrate and the countering substrate, wherein the first TFT comprises a source electrode and a drain electrode formed on the semiconductor layer; and

a light blocking metal layer formed on the light blocking semiconductor pattern and comprising substantially the same material as the source electrode and the drain electrode.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029045/0860 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2007
From: YOON, JOO-SUN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 019064/0973 →