SUBSTRATE EDGE EXPOSURE APPARATUS
Prior to edge exposure, the type of a photo resist that has been coated on a semiconductor wafer is identified. Then, the sensitivity of this resist is determined based on the information of the identified resist type. Based on the determined resist sensitivity, a laser output from a semiconductor laser light source, and a wafer rotation speed attained by a wafer rotating part are determined, and the edge exposure is then performed in accordance with these determined values. Thus, both of the laser output and the wafer rotation speed can be determined based on the resist sensitivity, and the edge exposure can be advanced in accordance with these values. It is therefore capable of flexibly coping with the sensitivity of the resist used.
1 . A substrate edge exposure apparatus for exposing an edge of a substrate with a photo resist coated thereon, comprising:
a holding and rotating part for holding and rotating a substrate in a substantially horizontal plane;
a semiconductor laser light source for irradiating a laser light to an edge of said substrate rotated by said holding and rotating part;
a processing condition determining part for determining a laser output from said semiconductor laser light source and a substrate rotation speed attained by said holding and rotating part, based on a sensitivity of a photo resist coated on said substrate;
a rotation control part for controlling said holding and rotating part so that said substrate can be rotated at the substrate rotation speed determined by said processing condition determining part; and
an output control part for controlling said semiconductor laser light source so that a laser light can be emitted according to the laser output determined by said processing condition determining part.
2 . The substrate edge exposure apparatus according to claim 1 , further comprising:
a resist type identifying part for identifying a type of said photo resist to be coated on said substrate; and
a resist sensitivity judging part for judging a sensitivity of said photo resist from the type of said photo resist identified by said resist type identifying part.
3 . The substrate edge exposure apparatus according to claim 1 , wherein said processing condition determining part determines a laser output from said semiconductor laser light source and a substrate rotation speed attained by said holding and rotating part, so that a process can be completed within a preset edge exposure time.
4 . The substrate edge exposure apparatus according to claim 3 , wherein said processing condition determining part determines a laser output from said semiconductor laser light source at a high value, as said sensitivity of said photo resist coated on said substrate is lowered.
5 . The substrate edge exposure apparatus according to claim 3 , wherein said processing condition determining part determines a substrate rotation speed attained by said holding and rotating part at a low value, as said sensitivity of said photo resist coated on said substrate is lowered.
6 . The substrate edge exposure apparatus according to claim 3 , further comprising:
a mode input part for inputting a throughput priority mode or a life priority mode as a mode of edge exposure, wherein,
when the throughput priority mode is selected, said processing condition determining part determines a laser output from said semiconductor laser light source at a high value, as said sensitivity of said photo resist coated on said substrate is lowered; and when the life priority mode is selected, said processing condition determining part determines a substrate rotation speed attained by said holding and rotating part at a low value, as said sensitivity of said photo resist coated on said substrate is lowered.
7 . A substrate edge exposure apparatus for exposing an edge of a substrate with a photo resist coated thereon, comprising:
a holding and rotating part for holding and rotating a substrate in a substantially horizontal plane;
a light emitting diode light source for irradiating a light to an edge of said substrate rotated by said holding and rotating part;
a processing condition determining part for determining, based on a sensitivity of a photo resist coated on said substrate, a light output from said light emitting diode light source and a substrate rotation speed attained by said holding and rotating part;
a rotation control part for controlling said holding and rotating part so that said substrate can be rotated at the substrate rotation speed determined by said processing condition determining part; and
an output control part for controlling said light emitting diode light source so that a light can be emitted according to the light output determined by said processing condition determining part.
8 . The substrate edge exposure apparatus according to claim 7 , further comprising:
a resist type identifying part for identifying a type of said photo resist coated on said substrate; and
a resist sensitivity judging part for judging a sensitivity of said photo resist from the type of said photo resist identified by said resist type identifying part.
9 . The substrate edge exposure apparatus according to claim 7 , wherein said processing condition determining part determines a light output from said light emitting diode light source and a substrate rotation speed attained by said holding and rotating part, so that a process can be completed within a preset edge exposure time.
10 . The substrate edge exposure apparatus according to claim 9 , wherein said processing condition determining part determines a light output from said light emitting diode light source at a high value, as said sensitivity of said photo resist coated on said substrate is lowered.
11 . The substrate edge exposure apparatus according to claim 9 , wherein said processing condition determining part determines a substrate rotation speed attained by said holding and rotating part at a low value, as said sensitivity of said photo resist coated on said substrate is lowered.
12 . The substrate edge exposure apparatus according to claim 9 , further comprising:
a mode input part for inputting a throughput priority mode or a life priority mode as a mode of edge exposure, wherein,
when the throughput priority mode is selected, said processing condition determining part determines a light output from said light emitting diode light source at a high value, as said sensitivity of said photo resist coated on said substrate is lowered; and when the life priority mode is selected, said processing condition determining part determines a substrate rotation speed attained by said holding and rotating part at a low value, as said sensitivity of said photo resist coated on said substrate is lowered.