Sensor component and method for producing a sensor component

1. A device for detecting a measured quantity, comprising:

a sensor chip for detecting the measured quantity;

a supply means for providing an energy supply; and

an injection-molded enclosure for accommodating the sensor chip and the supply means, the injection-molded enclosure comprising integrated conductive traces that provide an electrical connection between the sensor chip and the supply means,

wherein the injection-molded enclosure includes at least two components that differ from each other as to at least one of the following by at least 50%: their dielectric constant and their dissipation factor.

2. The device according to claim 1 , including furthermore means for wirelessly transmitting information.

3. The device according to claim 1 , wherein the injection-molded enclosure comprises at least one cavity in which at least one of the sensor chip and the supply means are arranged.

4. The device according to claim 1 , wherein the sensor chip and the supply means are arranged above each other.

5. The device according to claim 1 , wherein the supply means includes an energy generator, in order to generate electric energy from an environment.

6. The device according to claim 5 , wherein the energy generation occurs by using a movement or through power radiation.

7. A device for detecting a measured quantity, comprising:

a sensor chip for detecting the measured quantity;

a means for wirelessly transmitting information; and

an injection-molded enclosure for accommodating the sensor chip and the means for wirelessly transmitting, the injection-molded enclosure including integrated conductive traces that enable an electrical connection between the sensor chip and the means for wirelessly transmitting,

wherein the injection-molded enclosure includes at least two components that differ from each other as to at least one of the following by at least 50%: their dielectric constant and their dissipation factor.

8. The device according to claim 7 , comprising furthermore supply means for providing an energy supply.

9. A sensor component, comprising:

a sensor chip;

an energy-supply element; and

an injection-molded enclosure, which contains the sensor chip and the energy-supply element, the injection-molded enclosure including integrated conductive traces that enable an electrical connection between the sensor chip and the energy-supply element,

wherein the injection-molded enclosure includes at least two components that differ from each other as to at least one of the following by at least 50%: their dielectric constant and their dissipation factor.

10. The sensor component according to claim 9 , including furthermore a transmitter.

11. The sensor component according to claim 9 , including furthermore at least one of a receiver and a transceiver.

12. The sensor component according to claim 9 , wherein the injection-molded enclosure comprises at least one cavity in which at least one of the sensor chip and the energy-supply element is arranged.

13. The sensor component according to claim 12 , wherein the at least one cavity is at least partially filled with a sealing compound.

14. The sensor component according to claim 12 , wherein the at least one cavity is covered with a cover.

15. The sensor component according to claim 14 , wherein the cover includes the energy-supply element or the cover includes a further energy-supply element.

16. The sensor component according to claim 9 , comprising furthermore an antenna that is applied on an outer face of the injection-molded enclosure.

17. The sensor component according to claim 9 , wherein the sensor chip includes a pressure sensor.

18. A sensor component, comprising:

a pressure sensor;

an energy-supply element;

a transmitter;

an antenna; and

an injection-molded enclosure with an opening and a cover, the opening connecting an inner space of the injection-molded enclosure to an environment, the pressure sensor being arranged in the inner space, above the opening, and the energy-supply element and the transmitter being arranged in the inner space,

wherein the injection-molded enclosure includes at least two components that differ from each other as to at least one of the following by at least 50%: their dielectric constant and their dissipation factor.

19. The sensor component according to claim 18 , wherein the injection-molded enclosure includes integrated conductive traces.

20. The sensor component according to claim 19 , comprising furthermore wire bonds for connecting the energy-supply element, the transmitter and the pressure sensor through the wire bonds and the integrated conductive traces.

21. The sensor component according to claim 18 , wherein the cover includes a battery.

22. The sensor component according to claim 18 , comprising furthermore a thermal conductor.

23. The sensor component according to claim 18 , comprising furthermore a further sensor.

24. The sensor component according to claim 23 , wherein the further sensor is an acceleration sensor.

25. The sensor component according to claim 18 , comprising furthermore an evaluation circuit.

26. A method for producing a sensor component, comprising:

providing an injection-molded enclosure with a cavity and integrated conductive traces;

introducing a sensor chip into the cavity;

introducing an energy-supply element into the cavity; and

electrically connecting the sensor chip and the energy-supply element to the integrated conductive traces,

wherein the injection-molded enclosure includes at least two components that differ from each other as to at least one of the following by at least 50%: their dielectric constant and their dissipation factor.

27. The method according to claim 26 , wherein the integrated conductive traces are generated through structuring a layer of conductive traces.

28. The method according to claim 27 , wherein the structuring includes a photolithographic process.

29. The method according to claim 26 , comprising furthermore introducing a sealing compound into the cavity.

30. The method according to claim 29 , wherein the sealing compound includes a silicone gel.

31. A method for producing a sensor component, comprising:

providing an injection-molded enclosure with a cavity and an opening;

arranging a pressure sensor in the cavity, above the opening;

arranging a transceiver in the cavity;

arranging a supply in the cavity; and

arranging an antenna on a side face of the injection-molded enclosure,

wherein the injection-molded enclosure includes at least two components that differ from each other as to at least one of the following by at least 50%: their dielectric constant and their dissipation factor.

32. The method according to claim 31 , comprising furthermore introducing a sealing compound.

33. The method according to claim 31 , comprising furthermore applying a cover, so that the cavity is separated from the environment by the cover.

34. The method according to claim 33 , wherein the cover is used as a wiring carrier.

35. The method according to claim 31 , comprising furthermore the provision of an energy generator, the energy generator being capable of generating electric energy from a power radiation.