IP Library Granted Patent US 7,646,615
Granted Patent B2
US 7,646,615 · App. 11/693,679 · Granted Jan 12, 2010

Electromagnetic inferference shield for an optoelectronic module

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Quick Facts
Patent No.
US 7,646,615
App. No.
11/693,679
Granted
Jan 12, 2010
Kind
B2
Abstract

An electromagnetic interference (“EMI”) shield that can help control the emission of electromagnetic radiation from an optoelectronic module in which the EMI shield is positioned. In one example embodiment, an EMI shield includes a base and plurality of flanges extending from a perimeter of the base. The base defines an optical subassembly (“OSA”) opening and a plurality of complementary structures. The OSA opening is configured to receive an OSA. Each complementary structure is configured to engage a complementary structure of an OSA connector block.

Claims (21)

1. An optoelectronic module comprising:

an electrically conductive housing;

a transmitter OSA (optical subassembly) at least partially situated within the housing;

a receiver OSA at least partially situated within the housing;

a PCB at least partially situated within the housing, the PCB being in electrical communication with the transmitter OSA and the receiver OSA;

a pair of OSA connector blocks at least partially situated within the housing, each OSA connector block corresponding to one of the OSAs, each OSA connector block comprising:

a monolithic body including:

a first end defining a receptacle, the receptacle being configured to receive at least a portion of an optical fiber connector; and

a second end defining a cavity in which at least a portion of the corresponding OSA is situated; and

a pair of EMI shields each attached to one of the OSA connector blocks, each EMI shield comprising:

a base defining an OSA opening in which at least a portion of the corresponding OSA is situated; and

a plurality of flanges extending from a perimeter of the base, each of the plurality of flanges being in electrical communication with the housing, each of the plurality of flanges being deflected by the housing.

2. The optoelectronic module as recited in claim 1 , wherein:

the monolithic body further includes a plurality of posts; and

the base further defines a plurality of mounting holes in each of which a corresponding post is situated,

wherein each of the plurality of posts is swaged so as to permanently attach the EMI shield to the monolithic body.

3. The optoelectronic module as recited in claim 1 , wherein each receptacle is configured to receive an SC optical fiber connector.

4. The optoelectronic module as recited in claim 1 , wherein each OSA connector block further includes a pair of substantially non-conductive optical connector latch arms, each optical connector latch arm at least partially situated within one of a pair of openings defined in the corresponding monolithic body, at least a portion of each optical connector latch arm extending into the receptacle of the corresponding monolithic body and configured to engage an optical fiber connector.

5. The optoelectronic module as recited in claim 1 , wherein the housing further comprises plurality of structures configured to engage one or more of the flanges of the EMI shield.

6. The optoelectronic module as recited in claim 1 , wherein each EMI shield is substantially symmetric across an x-z plane and a y-z plane.

7. The optoelectronic module as recited in claim 1 , wherein the optoelectronic module substantially conforms to the X2 Multi-Source Agreement.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 26, 2007
From: ICE, DONALD A.
To: FINISAR CORPORATION
Reel/Frame 019218/0475 →