IP Library Granted Patent US 7,795,614
Granted Patent B2
US 7,795,614 · App. 11/695,138 · Granted Sep 14, 2010

Device with phase-separated dielectric structure

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Quick Facts
Patent No.
US 7,795,614
App. No.
11/695,138
Granted
Sep 14, 2010
Kind
B2
Abstract

An electronic device including in any sequence: (a) a semiconductor layer; and (b) a phase-separated dielectric structure comprising a lower-k dielectric polymer and a higher-k dielectric polymer, wherein the lower-k dielectric polymer is in a higher concentration than the higher-k dielectric polymer in a region of the dielectric structure closest to the semiconductor layer.

Claims (45)

1. An electronic device comprising in any sequence:

(a) a semiconductor layer; and

(b) a single, phase separated dielectric layer comprising a lower-k dielectric polymer and a higher-k dielectric polymer, wherein the lower-k dielectric polymer is in a higher concentration than the higher-k dielectric polymer in a region of the dielectric layer closest to the semiconductor layer;

wherein the phase separated dielectric layer comprises a morphology of:

(i) a first phase forming a plurality of dots in a continuous matrix of a second phase;

(ii) a first phase forming a plurality of rods in a continuous matrix of a second phase; or

(iii) a first phase interpenetrating into a second phase to form bicontinuous domains.

2. The electronic device of claim 1 , wherein the lower-k dielectric polymer is at a concentration ranging from about 60% to 100% and the higher-k dielectric polymer is at a concentration ranging from about 40% to 0% of the total weight of the lower-k and the higher-k dielectric polymers in the region of the dielectric layer closest to the semiconductor layer.

3. The electronic device of claim 1 , wherein the lower-k dielectric polymer is at a concentration ranging from about 80% to 100% and the higher-k dielectric polymer is at a concentration ranging from about 20% to 0% of the total weight of the lower-k and the higher-k dielectric polymers in the region of the dielectric layer closest to the semiconductor layer.

4. The electronic device of claim 1 , wherein the lower-k dielectric polymer has a dielectric constant of less than 4.0.

5. The electronic device of claim 1 , wherein the higher-k dielectric polymer has a dielectric constant of 4.0 or more.

6. An electronic device comprising in any sequence:

(a) an organic semiconductor layer; and

(b) a single, phase separated dielectric layer comprising a lower-k dielectric polymer and a higher-k dielectric polymer, wherein the lower-k dielectric polymer is at a concentration ranging from about 60% to 100% and the higher-k dielectric polymer is at a concentration ranging from about 40% to 0% of the total weight of the lower-k and the higher-k dielectric polymers in a region of the dielectric layer closest to the semiconductor layer,

wherein the phase separated dielectric layer comprises a morphology of;

(i) a first phase forming a plurality of dots in a continuous matrix of a second phase;

(ii) a first phase forming a plurality of rods in a continuous matrix of a second phase; or

(iii) a first phase interpenetrating into a second phase to form bicontinuous domains.

7. The electronic device of claim 6 , wherein the lower-k dielectric polymer is at a concentration ranging from about 80% to 100% and the higher-k dielectric polymer is at a concentration ranging from about 20% to 0% of the total weight of the lower-k and the higher-k dielectric polymers in the region of the dielectric layer closest to the semiconductor layer.

8. The electronic device of claim 6 , wherein the lower-k dielectric polymer has a dielectric constant of less than 4.0.

9. The electronic device of claim 6 , wherein the higher-k dielectric polymer has a dielectric constant of 4.0 or more.

10. A thin film transistor comprising in any sequence:

(a) a semiconductor layer; and

(b) a single, phase separated gate dielectric layer comprising a lower-k dielectric polymer-majority/higher-k dielectric polymer-minority first phase and a higher-k dielectric polymer-majority/lower-k dielectric polymer-minority second phase, wherein the lower-k dielectric polymer is in a higher concentration than the higher-k dielectric polymer in a region of the dielectric layer closest to the semiconductor layer;

wherein the phase separated dielectric layer comprises a morphology of:

(i) a first phase forming a plurality of dots in a continuous matrix of a second phase;

(ii) a first phase forming a plurality of rods in a continuous matrix of a second phase; or

(iii) a first phase interpenetrating into a second phase to form bicontinuous domains.

11. The thin film transistor of claim 10 , wherein the lower-k dielectric polymer is at a concentration ranging from about 60% to 100% and the higher-k dielectric polymer is at a concentration ranging from about 40% to 0% of the total weight of the lower-k and the higher-k dielectric polymers in the region of the dielectric layer closest to the semiconductor layer.

12. The electronic device of claim 10 , wherein the lower-k dielectric polymer is at a concentration ranging from about 80% to 100% and the higher-k dielectric polymer is at a concentration ranging from about 20% to 0% of the total weight of the lower-k and the higher-k dielectric polymers in the region of the dielectric layer closest to the semiconductor layer.

13. The thin film transistor of claim 10 , wherein the lower-k dielectric polymer has a dielectric constant of less than 4.0.

14. The thin film transistor of claim 10 , wherein the higher-k dielectric polymer has a dielectric constant of 4.0 or more.

15. The thin film transistor of claim 10 , wherein the lower-k dielectric polymer and the higher-k dielectric polymer are crosslinked.

16. A thin film transistor comprising in any sequence:

(a) a semiconductor layer; and

(b) a single, phase separated gate dielectric layer comprising a polymer blend of a lower-k dielectric polymer and a higher-k dielectric polymer;

wherein the lower-k dielectric polymer is a polysilsesquioxane;

wherein the higher-k dielectric polymer is poly(2-hydroxylethyl methacrylate); and

wherein the phase separated dielectric layer comprises a morphology of:

(i) a first phase forming a plurality of dots in a continuous matrix of a second phase;

(ii) a first phase forming a plurality of rods in a continuous matrix of a second phase; or

(iii) a first phase interpenetrating into a second phase to form bicontinuous domains.

17. The thin film transistor of claim 16 , wherein the lower-k dielectric polymer is poly(methyl silsesquioxane).

18. The thin film transistor of claim 16 , wherein the polymer blend further comprises inorganic nanoparticles.

19. The thin film transistor of claim 16 , wherein the higher-k dielectric polymer is crosslinked.

Assignments (10)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 6, 2025
From: XEROX CORPORATION
To: GENESEE VALLEY INNOVATIONS, LLC
Reel/Frame 073842/0479 →
SECOND LIEN NOTES PATENT SECURITY AGREEMENT Recorded Jul 2, 2025
From: XEROX CORPORATION
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 071785/0550 →
FIRST LIEN NOTES PATENT SECURITY AGREEMENT Recorded Apr 11, 2025
From: XEROX CORPORATION
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 070824/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT RF 064760/0389 Recorded Feb 13, 2024
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: XEROX CORPORATION
Reel/Frame 068261/0001 →
SECURITY INTEREST Recorded Feb 13, 2024
From: XEROX CORPORATION
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 066741/0001 →
SECURITY INTEREST Recorded Nov 20, 2023
From: XEROX CORPORATION
To: JEFFERIES FINANCE LLC, AS COLLATERAL AGENT
Reel/Frame 065628/0019 →
SECURITY INTEREST Recorded Jun 22, 2023
From: XEROX CORPORATION
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 064760/0389 →
RELEASE OF SECURITY INTEREST IN PATENTS AT R/F 062740/0214 Recorded May 18, 2023
From: CITIBANK, N.A., AS AGENT
To: XEROX CORPORATION
Reel/Frame 063694/0122 →
SECURITY INTEREST Recorded Nov 10, 2022
From: XEROX CORPORATION
To: CITIBANK, N.A., AS AGENT
Reel/Frame 062740/0214 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2007
From: WU, YILIANG , ,; MAHABADI, HADI K, ,; ONG, BENG S, ,; SMITH, PAUL F, ,
To: XEROX CORPORATION
Reel/Frame 019195/0416 →