Chip package, method of making same and digital camera module using the package
A digital camera module ( 100 ) includes a chip package ( 110 ) and a lens module ( 130 ), mounted on the chip package, for forming a focused image on the chip package. The chip package includes a supporter ( 112 ), a chip ( 114 ), a plurality of wires ( 116 ), a main adhesive ( 118 ), and a cover plate ( 119 ). The supporter includes a through hole defined therethrough and has a plurality of top contacts ( 1130 ) formed thereon around the through hole. The chip is disposed in the through hole and includes a plurality of pads ( 1144 ) arranged thereon. The wires electrically connect the pads to the top contacts. The main adhesive is applied to a gap between the chip and the supporter and fixes the chip to the supporter. The cover plate is adhered and supported on the main adhesive. A method for making the chip package is also provided.
1. A chip package, comprising:
a supporter having a through hole defined therethrough and having a plurality of top contacts formed thereon around the through hole;
a chip disposed in the through hole, the chip having a plurality of pads arranged thereon;
a plurality of wires respectively electrically connecting the corresponding pads to the corresponding top contacts;
a main adhesive applied to a gap between the chip and the supporter, the main adhesive fixing the chip to the supporter; and
a cover plate supported on the main adhesive.
2. The chip package as claimed in claim 1 , wherein the chip has an active area surrounded by the pads, the main adhesive is applied to the chip around the active area, and the cover plate and the main adhesive cooperatively enclose the active area.
3. The chip package as claimed in claim 2 , wherein the main adhesive is configured to hold the cover above each wire.
4. The chip package as claimed in claim 3 , wherein the supporter has a top surface on which the top contacts are arranged, the supporter further has a frame portion extending upwardly from an outer periphery of the top surface and surrounding the top contacts.
5. The chip package as claimed in claim 3 , wherein the supporter has a top surface on which the top contacts are arranged, the supporter further has a frame portion extending upwardly from the top surface and surrounding the top contacts, and the frame portion is spaced at a distance from an outer periphery of the top surface.
6. A method of making a chip package, comprising the following steps:
providing a temporary sheet with a planar surface;
attaching a chip onto the planar surface of the temporary sheet, the chip having a top surface with a plurality of pads formed thereon;
placing a supporter with a through hole defined therein onto the planar surface of the temporary sheet, the chip being received in the through hole of the supporter, the supporter having a plurality of top conducts formed thereon;
electrically connecting each respective pad with a corresponding top contact via a respective wire;
applying a main adhesive to a gap between the chip and the supporter;
placing a cover plate onto the main adhesive;
curing the main adhesive; and
removing the temporary sheet.
7. A digital camera module, comprising:
a chip package comprising:
a supporter having a through hole defined therethrough and having a plurality of top contacts formed thereon around the through hole;
a chip disposed in the through hole, the chip having a plurality of pads arranged thereon;
a plurality of wires respectively electrically connecting the corresponding pads to the corresponding top contacts;
a main adhesive applied to a gap between the chip and the supporter, the main adhesive fixing the chip to the supporter; and
a cover plate supported on the main adhesive; and
a lens module mounted to the chip package to form a focused image on the chip.
8. The digital camera module as claimed in claim 7 , wherein the chip has an active area surrounded by the pads, and the main adhesive is applied to the chip around the active area, and the cover plate and the main adhesive cooperatively enclose the active area.
9. The digital camera module as claimed in claim 8 , wherein the main adhesive is configured to hold the cover above each wire loop formed by a respective wire.
10. The digital camera module as claimed in claim 8 , wherein the lens module has a holder, and at least one lens is received in the holder and thereby configured to form a focused image on the chip.
11. The digital camera module as claimed in claim 10 , wherein the lens holder comprises a top board and a pedestal protruding from an outer periphery of the top board, the pedestal has an end, and the end of the pedestal is mounted to the chip package.
12. The digital camera module as claimed in claim 11 , wherein the pedestal of the lens holder is adhered to an outside surface of the supporter.
13. The digital camera module as claimed in claim 11 , wherein the pedestal of the lens holder is adhered to the top surface of the supporter.
14. The digital camera module as claimed in claim 13 , wherein the supporter has a top surface on which the top contacts are arranged, the supporter has a frame portion extending upwardly from an outer periphery of the top surface thereof and surrounding the top contacts, and the pedestal is mounted on a top of the frame portion.
15. The digital camera module as claimed in claim 13 , wherein the supporter has a top surface on with the top contacts are arranged, the supporter has a frame portion extending upwardly from the top surface and surrounding the top contacts, and the frame portion is spaced at a distance from an outer periphery of the top surface and thereby forms a mounting surface at an outer periphery of the top surface, and the pedestal is mounted to the mounting surface with an inner periphery of the pedestal abutting against an outer periphery of the frame portion.
16. The digital camera module as claimed in claim 11 , wherein the pedestal is mounted to the cover of the chip package.