Organic light emitting device and method of fabricating the same

1. An organic light emitting device (OLED), comprising:

a first substrate; and

a second substrate, opposing the first substrate and comprising a plurality of sub-pixels, each said sub-pixel comprising a light-emitting region and a non light-emitting region;

wherein the first substrate comprises

a plurality of transistors electrically connected to each other and corresponding to the plurality of sub-pixels of the second substrate, respectively; and

for each said sub-pixel, a first connecting electrode electrically connected to the respective one of the plurality of transistors;

wherein the second substrate further comprises, for each said sub-pixel,

a second connecting electrode formed in the non light-emitting region, the second connecting electrode including a lower electrode, a connecting body, an organic layer and an upper electrode, the organic layer disposed between the connecting body and the upper electrode, the lower electrode and the upper electrode enclosing the connecting body and the organic layer, and

a barrier wall encompassing the second connecting electrode, wherein a top of the second connecting electrode is no lower than a top of the barrier wall; and

wherein the second connecting electrode is electrically connected to the first connecting electrode, so that the first substrate and the second substrate are electrically connected.

2. The device according to claim 1 , wherein the plurality of transistors on the first substrate comprises a plurality of switching transistors and a plurality of driver transistors, the first connecting electrode comprises a contact electrode on a source or a drain of the respective one of the plurality of driver transistors.

3. The device according to claim 2 , wherein the first connecting electrode further comprises an enhancive electrode electrically connected to the contact electrode of the source or the drain of the respective one of the plurality of driver transistors.

4. The device according to claim 1 , wherein the light-emitting region in each said sub-pixel of the second substrate comprises:

a first electrode formed on the second substrate;

a light emitting layer formed over the first electrode; and

a second electrode formed over the light emitting layer.

5. The device according to claim 4 , wherein the second connecting electrode in the non light-emitting region of each said sub-pixel of the second substrate comprises:

the lower electrode, formed on the second substrate and electrically connected to the first electrode in the light-emitting region; and

the connecting body formed on the lower electrode; and

the upper electrode formed on the connecting body.

6. The device according to claim 5 , wherein the connecting body is a patterned conductor or a non-conductive pattern.

7. The device according to claim 5 , wherein the lower electrode in the non light-emitting region of each said sub-pixel on the second substrate is made of the same material as the first electrode in the light-emitting region.

8. The device according to claim 5 , wherein the upper electrode in the non light-emitting region of each said sub-pixel on the second substrate is made of the same material as the second electrode in the light-emitting region.

9. The device according to claim 8 , wherein the light emitting layer in the light-emitting region of each said sub-pixel on the second substrate is made of the same material as the organic layer in the non light-emitting region.

10. An organic light emitting device (OLED), comprising:

a first substrate; and

a second substrate opposing the first substrate and comprising a plurality of sub-pixels, each said sub-pixel comprising a light-emitting region and a non light-emitting region;

wherein the first substrate comprises:

a plurality of switching transistors and a plurality of driver transistors electrically connected to each other and corresponding to the plurality of sub-pixels of the second substrate; and

for each said sub-pixel, a first connecting electrode electrically connected to a respective one of the plurality of driver transistors;

wherein the second substrate further comprises, for each said sub-pixel, a second connecting electrode formed in the non light-emitting region, projecting towards the first substrate and comprising a conductive multilayer enclosing an organic layer and a connecting body, the organic layer disposed between the connecting body and an upper electrode;

wherein the first substrate and the second substrate are electrically connected by an electrical connection between the second connecting electrode and the first connecting electrode.

11. The device according to claim 10 , wherein the first connecting electrode comprises a contact electrode of a source or a drain of the respective one of the plurality of driver transistors.

12. The device according to claim 11 , wherein the first connecting electrode further comprises an enhancive electrode disposed over the contact electrode of the source or the drain of the respective one of the driver transistors.

13. The device according to claim 10 , wherein the light-emitting region in each said sub-pixel on the second substrate further comprises:

a first electrode, formed on the second substrate;

a light emitting layer, formed on the first electrode; and

a second electrode, formed on the light emitting layer.

14. The device according to claim 13 , wherein in each said sub-pixel on the second substrate, the conductive multilayer of the second connecting electrode in the non light-emitting region comprises:

a lower electrode, formed on the second substrate and electrically connected to the first electrode in the light-emitting region, wherein the connecting body is formed on the lower electrode; and

the upper electrode, formed on the connecting body and encompassing the connecting body, the upper electrode being electrically connected to the lower electrode outside the connecting body.

15. The device according to claim 14 , further comprising at least one of the following:

wherein the lower electrode in the non light-emitting region of the second substrate is made of the same material as the first electrode in the light-emitting region,

wherein the upper electrode in the non light-emitting region is made of the same material as the second electrode in light-emitting region, and

wherein the organic layer in the non light-emitting region is made of the same material as the light emitting layer in the light-emitting region.

16. A method of fabricating an organic light emitting device (OLED) from first and second substrates wherein the second substrate comprises a plurality of sub-pixels, and the first substrate comprises a plurality of transistors electrically connected to each other and corresponding to the plurality of sub-pixels of the second substrate, respectively, said method comprising:

for each said sub-pixel, forming a first connecting electrode on the first substrate and electrically connecting the first connecting electrode to the respective one of the plurality of transistors;

defining in each said sub-pixel a light-emitting region and a non light-emitting region;

forming a second connecting electrode in the non light-emitting region of each said sub-pixel, the second connecting electrode including a lower electrode, a connecting body, an organic layer and an upper electrode, the lower electrode and the upper electrode enclosing the connecting body and the organic layer, the organic layer between the connecting body and the upper electrode, the second connecting electrode projecting toward the first substrate; and

assembling the first substrate and the second substrate for electrically connecting the first connecting electrode and the second connecting electrode.

17. The method according to claim 16 further comprising, for each said sub-pixel:

forming a first electrode in the light-emitting region on the second substrate;

forming a light-emitting layer over the first electrode in the light-emitting region on the second substrate; and

forming a second electrode over the light-emitting layer in the light-emitting region on the second substrate.

18. The method according to claim 17 , wherein step of forming the second connecting electrode in each said sub-pixel comprises:

forming the lower electrode on the second substrate and electrically connecting the lower electrode to the first electrode in the light-emitting region;

forming a the connecting body over the lower electrode, and the connecting body projecting toward the first substrate; and

forming the upper electrode for covering the connecting body, and electrically connecting the upper electrode and the lower electrode.

19. The method according to claim 18 , further comprising at least one of the following:

wherein the lower electrode in the non light-emitting region of the second substrate and the first electrode in the light-emitting region are formed at the same time and from the same material;

wherein the upper electrode in the non light-emitting region on the second substrate and the second electrode in the light-emitting region are formed at the same time and from the same material; and

wherein the organic layer in the non light-emitting region and the light-emitting layer in the light-emitting region are formed at the same time and from the same material.

20. The method according to claim 18 , wherein

the transistors on the first substrate comprise a plurality of switching transistors and driver transistors; and

for each said sub-pixel, the first connecting electrode comprises a contact electrode of a source or a drain of the respective one of the driver transistors.