Surface mounting device-type light emitting diode
A surface mounting device-type light emitting diode (SMD-type LED) comprises a package housing one or more pairs of electrodes therein, the package having a predetermined space in the center thereof and a light-emission window which is opened so that light is emitted through the light-emission window; a lens formed on the package so as to cover the light-emission window; an LED chip formed on an electrode inside the package; a wire for electrically connecting the LED chip and the electrode; and a phosphor-mixed layer formed on the surface of the lens adjacent to the light-emission window.
1. A surface mounting device-type light emitting diode (SMD-type LED) comprising:
a package housing one or more pairs of electrodes therein, the package having a predetermined space in the center thereof and a light-emission window which is opened so that light is emitted through the light-emission window;
a lens formed on the package so as to cover the light-emission window;
an LED chip formed on an electrode inside the package;
a wire for electrically connecting the LED chip and the electrode; and
a phosphor-mixed layer formed on the surface of the lens adjacent to the light-emission window;
wherein the surface of the lens having the phosphor-mixed layer formed thereon is formed with a groove concave toward the lens with respect to the surface of the light-emission window; and
wherein the concave groove is formed with an inclined surface which is tapered toward the central portion from both ends of the groove.
2. The SMD-type LED according to claim 1 ,
wherein the reverse surface of the lens having the phosphor-mixed layer formed thereon is a hemispheric surface convex toward the outside.
3. The SMD-type LED according to claim 1 further comprising
air filled in the package so as to protect the LED chip and the wire.
4. The SMD-type LED according to claim 1 further comprising
liquid resin filled in the package so as to protect the LED chip and the wire.
5. The SMD-type LED according to claim 1 ,
wherein the package is formed of molding resin such that a portion of a lead frame composed of one or more pairs of lead electrodes is housed therein.
6. The SMD-type LED according to claim 5 ,
wherein the molding resin is transparent or opaque synthetic resin.
7. The SMD-type LED according to claim 1 ,
wherein the package is composed of a printed circuit board on which one or more pairs of electrodes are printed.
8. A surface mounting device-type light emitting diode (SMD-type LED) comprising:
a package housing one or more pairs of electrodes therein, the package having a predetermined space in the center thereof and a light-emission window which is opened so that light is emitted through the light-emission window;
a lens formed on the package so as to cover the light-emission window;
an LED chip formed on an electrode inside the package;
a wire for electrically connecting the LED chip and the electrode; and
a phosphor-mixed layer formed on the surface of the lens adjacent to the light-emission window;
wherein the surface of the lens having the phosphor-mixed layer formed thereon is formed with a groove concave toward the lens with respect to the surface of the light-emission window; and
wherein the concave groove is formed with an irregular surface.