IP Library Granted Patent US 7,511,942
Granted Patent B2
US 7,511,942 · App. 11/697,674 · Granted Mar 31, 2009

Thermal interconnection for capacitor systems

Assignee: Maxwell Technologies, Inc.
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Quick Facts
Patent No.
US 7,511,942
App. No.
11/697,674
Granted
Mar 31, 2009
Kind
B2
Abstract

Thermal protection is provided in systems utilizing high-current double-layer capacitors.

Claims (34)

1. A system, comprising:

at least one double-layer capacitor; and

an interconnection comprising a low temperature melting point alloy, the interconnection coupled to the at least one double-layer capacitor for carrying capacitor current to or from the least one double-layer capacitor, the interconnection functionally coupled to the at least one double-layer capacitor to reduce a temperature of the at least one double-layer capacitor.

2. The system of claim 1 , wherein the temperature is above about 85 degrees Celsius.

3. The system of claim 1 , wherein the temperature is reduced independent of the current.

4. The system of claim 1 , wherein the interconnection comprises an increased surface area.

5. The system of claim 1 , wherein the low temperature melting point alloy is selected from a group consisting of Bismuth-Lead, Tin, Cadmium, and Indium.

6. The system of claim 1 , wherein the current comprises a current of at least 275 amps.

7. The system of claim 1 , wherein the at least one double-layer capacitor is coupled to an electrical device.

8. The system of claim 7 , wherein the electrical device is a vehicular electrical device.

9. The system of claim 8 , wherein the electrical device comprises an engine.

10. The system of claim 9 , wherein the system utilizes a voltage above 40 volts.

11. The system of claim 7 , wherein the system utilizes a voltage above 40 volts.

12. A system, comprising:

at least one double-layer capacitor; and

an interconnection coupled to the at least one double-layer capacitor for carrying capacitor current to or from the a least one double-layer capacitor, the interconnection functionally coupled to the at least one double-layer capacitor to reduce a temperature of the at least one double-layer capacitor, wherein the interconnection comprises a thermal fuse for interrupting the current to or from the at least one double-layer capacitor.

13. The system of claim 12 , wherein the thermal fuse comprises a bus bar.

14. The system of claim 12 , wherein the thermal fuse comprises a low temperature melting point alloy.

15. The system of claim 14 , wherein the low temperature melting point alloy is selected from a group consisting of Bismuth-Lead, Tin, Cadmium, and Indium.

16. A system, comprising:

at least one double-layer capacitor; and

an interconnection coupled to the at least one double-layer capacitor for carrying capacitor current to or from the a least one double-layer capacitor, the interconnection functionally coupled to the at least one double-layer capacitor to reduce a temperature of the at least one double-layer capacitor, wherein the interconnection comprises a thermal contactor for bypassing current around the at least one double-layer capacitor.

17. The system of claim 16 , wherein the thermal contactor comprises a low temperature melting point alloy.

18. The system of claim 17 , wherein the low temperature melting point alloy is selected from a group consisting of Bismuth-Lead, Tin, Cadmium, and Indium.

19. A system, comprising:

a first double-layer capacitor comprising a first terminal and a second terminal;

a second double-layer capacitor comprising a third terminal and a fourth terminal;

an interconnection coupled to the second terminal of the first double-layer capacitor and the third terminal of the second double-layer capacitor for carrying capacitor current to or from the first double-layer capacitor, the interconnection functionally coupled to the first double-layer capacitor to reduce a temperature of the first double-layer capacitor; and

a balancing circuit connected to the first terminal of the first double-layer capacitor and the fourth terminal of the second double-layer capacitor.

20. The system of claim 19 , wherein the at least one double-layer capacitor is coupled to an electrical device.

21. The system of claim 20 , wherein the electrical device is a vehicular electrical device.

22. The system of claim 21 , wherein the electrical device comprises an engine.

23. The system of claim 22 , wherein the system utilizes a voltage above 40 volts.

24. The system of claim 19 , wherein the interconnection comprises a low temperature melting point alloy.

Assignments (9)
RELEASE OF SECURITY INTEREST Recorded Oct 31, 2025
From: BHAGATAVULA, ANAND
To: UCAP POWER, INC.
Reel/Frame 073428/0461 →
RELEASE OF SECURITY INTEREST Recorded Oct 28, 2025
From: BHAGATAVULA, ANAND
To: UCAP POWER, INC.
Reel/Frame 073369/0254 →
SECURITY INTEREST Recorded Aug 23, 2024
From: UCAP POWER, INC.
To: BHAGATAVULA, ANAND
Reel/Frame 068762/0463 →
SECURITY INTEREST Recorded Jun 14, 2024
From: UCAP POWER, INC.
To: ORRIS, JOHN
Reel/Frame 067736/0296 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 6, 2021
From: MAXWELL TECHNOLOGIES, INC.
To: UCAP POWER, INC.
Reel/Frame 057830/0647 →
RELEASE OF SECURITY INTEREST Recorded May 24, 2019
From: EAST WEST BANK
To: MAXWELL TECHNOLOGIES, INC.
Reel/Frame 051441/0005 →
RELEASE OF SECURITY INTEREST Recorded May 16, 2019
From: EAST WEST BANK
To: MAXWELL TECHNOLOGIES, INC.
Reel/Frame 049216/0304 →
SECURITY INTEREST Recorded Jul 6, 2015
From: MAXWELL TECHNOLOGIES, INC.
To: EAST WEST BANK
Reel/Frame 036064/0636 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 6, 2007
From: THRAP, GUY C.
To: MAXWELL TECHNOLOGIES, INC.
Reel/Frame 019391/0703 →
Continuity (2)
Continuation 1096016600 · Oct 7, 2004
Related Publication 20070177335A1 · Aug 2, 2007