Semiconductor optical device having current-confined structure
View Patent ↗Provided is a semiconductor optical device having a current-confined structure. The device includes a first semiconductor layer of a first conductivity type which is formed on a semiconductor substrate and includes one or more material layers, a second semiconductor layer which is formed on the first semiconductor layer and includes one or more material layers, and a third semiconductor layer of a second conductivity type which is formed on the second semiconductor layer and includes one or more material layers. One or more layers among the first semiconductor layer, the second semiconductor, and the third semiconductor layer have a mesa structure. A lateral portion of at least one of the material layers constituting the first semiconductor layer, the second semiconductor layer, and the third semiconductor layer is recessed, and the recess is partially or wholly filled with an oxide layer, a nitride layer or a combination of them. The semiconductor optical device having the current-confined region is mechanically reliable, highly thermally conductive, and commercially preferable and can be used in a wavelength range for optical communications.
1. A semiconductor optical device comprising:
confinement-conducting regions having semiconductor layers, each of the confinement-conducting regions including one or more material layers; and
a gain region having a semiconductor layer, which is formed between the confinement-conducting regions and includes one or more material layers,
wherein the confinement-conducting regions and the gain region have a mesa structure, and a lateral portion of at least one of the material layers constituting the semiconductor layers of the confinement-conducting regions and the gain region is recessed, and the recess is formed by selectively etching the lateral portion of at least one of the material layers and the material layers surrounding the recess have different etching rates compared to at least one of the material layers constituting the semiconductor layer of the gain region, and the recess is partially or wholly filled by deposition with an oxide layer, a nitride layer or a combination of them,
wherein at least one reflecting mirror is further formed so as to be parallel with the confinement-conducting regions and the gain region such that output light is perpendicular to the confinement-conducting regions and the gain region.
2. The device of claim 1 , wherein the oxide layer or the nitride layer or a combination of them is formed using atomic layer deposition.
3. The device of claim 1 , wherein the oxide layer or the nitride layer or a combination of them is formed of one of a ZnO, MgO, TiO 2 , Ta 2 O 5 , ZrO 2 , HfO 2 , SiO 2 , Al 2 O 3 , Si 3 N 4 , AlN, AlON and a combination of them.
4. The device of claim 1 , wherein the semiconductor layer constituting the confinement-conducting regions is one of a p-type semiconductor layer, an n-type semiconductor layer and a combination of them.
5. The device of claim 1 , wherein the semiconductor layer constituting the gain region is one of a p-type semiconductor layer, an n-type semiconductor layer, and an undoped semiconductor layer.
6. A semiconductor optical device comprising:
confinement-conducting regions having semiconductor layers, each of which includes one or more material layers; and
a gain region having a semiconductor layer, which is formed between the confinement-conducting regions and includes one or more material layers,
wherein the confinement-conducting regions and the gain region have a mesa structure, and a lateral portion of at least one of the material layers constituting the semiconductor layers of the confinement-conducting regions and the gain region is recessed, and the recess is formed by selectively etching the lateral portion of at least one of the material layers and the material layers surrounding the recess have different etching rates compared to at least one of the material layers constituting the semiconductor layer of the gain region, and the recess is partially or wholly filled by deposition with an oxide layer, a nitride layer or a combination of them.
7. The device of claim 6 , wherein the oxide layer, the nitride layer or a combination of them is formed using atomic layer deposition.
8. The device of claim 6 , wherein the oxide layer or the nitride layer or a combination of them is formed of one of a ZnO, MgO, TiO 2 , Ta 2 O 5 , ZrO 2 , HfO 2 , SiO 2 , Al 2 O 3 , Si 3 N 4 , AlN, AlON and a combination of them.
9. The device of claim 6 , wherein the semiconductor layer constituting the confinement-conducting regions is one of the group consisting of a p-type semiconductor layer, an n-type semiconductor layer and a combination of them.
10. The device of claim 6 , wherein the semiconductor layer constituting the gain region is one of a p-type semiconductor layer, an n-type semiconductor layer, and an undoped semiconductor layer.
11. A semiconductor optical device comprising:
confinement-conducting regions having semiconductor layers, each of which includes one or more material layers; and
a gain region having a semiconductor layer, which is formed between the confinement-conducting regions and includes one or more material layers,
wherein the confinement-conducting regions and the gain region have a mesa structure, and a lateral portion of at least one of the material layers constituting the semiconductor layers of the confinement-conducting regions and the gain region is recessed, and the recess is formed by selectively etching the lateral portion of at least one of the material layers and the material layers surrounding the recess are not selectively etched and the recess is partially or wholly filled by deposition with an oxide layer, a nitride layer or a combination of them and wherein at least one reflecting mirror is further formed so as to be perpendicular to the confinement-conducting regions and the gain region such that output light is parallel with the confinement-conducting regions and the gain region.