IP Library Granted Patent US 7,463,663
Granted Patent B2
US 7,463,663 · App. 11/703,159 · Granted Dec 9, 2008

Semiconductor laser diode and integrated semiconductor optical waveguide device

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Quick Facts
Patent No.
US 7,463,663
App. No.
11/703,159
Granted
Dec 9, 2008
Kind
B2
Abstract

A conventional semiconductor laser diode is small in optical power at a constant operating current and limited in ridge width when integrated with an optical device, which forces the integration to be performed by lowering the original characteristic and makes it difficult to reduce cost and power consumption. In a semiconductor laser diode, widening of the ridge width is made possible by lowering the difference in refractive indexes between the ridge and other components, diffusion current and increase in the difference of refractive indexes are prevented by forming approximately vertical grooves along both sides of the ridge, and deterioration in characteristics due to regrowth is prevented by forming a diffraction grating on the ridge. The semiconductor laser diode is integrated with an optical device such as electroabsorption type optical modulator without increase of growth cycles and without restriction of the ridge width by using a tapered waveguide.

Claims (8)

1. A semiconductor laser diode having a semiconductor substrate, a lower clad layer provided on the substrate, an active layer provided on the lower clad layer, an upper clad layer provided on the active layer, and a ridge provided on the upper clad layer, the semiconductor laser diode comprising:

an upper buffer layer formed between the upper clad layer and the ridge, and

grooves formed along both sides of the ridge into the buffer layer,

wherein the width of the grooves is from more than 0 to 200 nm and the angle of the side face of the groove with respect to the substrate surface is 90 degrees ±10 degrees at the central part of the depth.

2. The semiconductor laser diode according to claim 1 , wherein the grooves are formed through the entire thickness or part of the thickness of the upper buffer layer.

3. The semiconductor laser diode according to claim 1 , wherein the semiconductor substrate is formed of n-type InP, the lower clad layer is formed of n-type InGaAsP, the active layer is formed of InGaAsP, and the upper clad layer is formed of InGaAsP.

4. The semiconductor laser diode according to claim 1 , wherein the semiconductor substrate is formed of n-type InP, the lower clad layer is formed of n-type InGaAlAs, the active layer is formed of InGaAlAs, and the upper clad layer is formed of InGaAlAs.

5. The semiconductor laser diode according to claim 1 , wherein the semiconductor substrate is formed of n-type GaAs, the lower clad layer is formed of n-type AlGaInP, the active layer is formed of AlGaInP and GaInP, and the upper clad layer is formed of p-type AlGaInP.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: LUMENTUM JAPAN, INC.
To: LUMENTUMRADIANT GMBH
Reel/Frame 073971/0379 →
CHANGE OF NAME Recorded Jul 2, 2019
From: OCLARO JAPAN, INC.
To: LUMENTUM JAPAN, INC.
Reel/Frame 049669/0609 →
CHANGE OF NAME Recorded Dec 3, 2014
From: OPNEXT JAPAN, INC.
To: OCLARO JAPAN, INC.
Reel/Frame 034524/0875 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2007
From: FUKAMACHI, TOSHIHIKO; MAKINO, SHIGEKI; TANIGUCHI, TAKAFUMI; AOKI, MASAHIRO
To: OPNEXT JAPAN, INC.
Reel/Frame 019228/0796 →