Heatsink assembly structure

1. A heatsink assembly structure, combined with a heat-generating element, wherein the heat-generating element is disposed on a circuit board and produces heat, the heatsink assembly structure comprising:

a heat conducting board, attached to the heat-generating element and conducting the heat to the heat conducting board, wherein the heat conducting board comprises a fixing end fixed to the circuit board, and a plurality of through holes symmetric about the heat-generating element is formed in the heat conducting board in pairs;

a plurality of pressing members, fixed to the heat conducting board and disposed between the heat conducting board and the circuit board, wherein the pressing members are fixed at positions between the through holes in pairs; and

a plurality of spring plates, with two ends respectively penetrating through the through holes in pairs, and fixed to the pressing members between the through holes, such that when the spring plates are fixed to the circuit board with central portions of the spring plates, the spring plates generate pulling forces towards the circuit board at positions of the pressing members, so as to push the heat conducting board against the heat-generating element.

2. The heatsink assembly structure as claimed in claim 1 , further comprising a heatsink module disposed on the heat conducting board for dissipating the heat conducted by the heat conducting board.

3. The heatsink assembly structure as claimed in claim 1 , wherein the pressing member comprises a combining portion and a head portion extending from the combining portion, the pressing member is fixed to the heat conducting board through the combining portion, and the spring plate is pressed against the head portion to generate the pulling force towards the circuit board.

4. The heatsink assembly structure as claimed in claim 1 , wherein a height of the pressing member is smaller than a space between the heat conducting board and the circuit board.

5. The heatsink assembly structure as claimed in claim 1 , wherein the pressing member is in an inverted T shape.

6. The heatsink assembly structure as claimed in claim 5 , wherein the pressing member is a rivet.

7. The heatsink assembly structure as claimed in claim 1 , wherein the through holes in pairs for two ends of one of the spring plates to penetrate through is arranged correspondingly.

8. The heatsink assembly structure as claimed in claim 1 , wherein the spring plates are double-arch shaped, and penetrate through the through holes in pairs in the heat conducting board.

9. The heatsink assembly structure as claimed in claim 1 , wherein the fixing end of the heat conducting board further has a fixing hole for an end of the heat conducting board to be fixed to the circuit board.

10. The heatsink assembly structure as claimed in claim 1 , wherein the fixing end of the heat conducting board is screwed on the circuit board.

11. The heatsink assembly structure as claimed in claim 1 , comprising two spring plates and eight through holes, wherein the eight through holes are symmetrically arranged on two sides of the heat-generating element in straight lines, and the spring plates are fixed to the circuit board with the central portions of the spring plates aligned with central positions of the four through holes arranged in a straight line on a same side.

12. A heatsink assembly structure, combined with a heat-generating element, wherein the heat-generating element is disposed on a circuit board and produces heat, the heatsink assembly structure comprising:

a heat conducting board, attached to the heat-generating element and conducting the heat to the heat conducting board, wherein the heat conducting board has a fixing hole at a fixing end for screwing the heat conducting board to the circuit board, eight through holes are opened in the heat conducting board in pairs, and the eight through holes are symmetrically arranged on two sides of the heat-generating element in straight lines;

a heatsink module, disposed on the heat conducting board for dissipating the heat conducted by the heat conducting board;

four rivets, respectively fixed to the heat conducting board between the heat conducting board and the circuit board, wherein the rivets are in an inverted T shape and have a height smaller than a space between the heat conducting board and the circuit plate, the rivets are fixed at positions between the through holes in pairs, each of the rivets has a combining portion and a head portion extending from the combining portion, and the rivet is fixed to the heat conducting board through the combining portion thereof; and

two spring plates, being double-arch shaped, wherein two ends of the spring plates penetrates through the four through holes in pairs, and fixed to the pressing member between the through holes, the through holes in pairs for two ends of one of the spring plates to penetrate through is arranged correspondingly, when the spring plates are fixed to the circuit board with central portions of the spring plates, the spring plates are pressed against the head portion and generate pulling forces towards the circuit board at positions of the pressing members, so as to push the heat conducting board against the heat-generating element, and the spring plates are fixed to the circuit board with the central portions of the spring plates aligned with central positions of the four through holes arranged in a straight line on a same side.