IP Library Granted Patent US 7,794,215
Granted Patent B2
US 7,794,215 · App. 11/705,222 · Granted Sep 14, 2010

High pressure slurry plunger pump with clean fluid valve arrangement

Assignee: Regency Technologies LLC
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Quick Facts
Patent No.
US 7,794,215
App. No.
11/705,222
Granted
Sep 14, 2010
Kind
B2
Abstract

A high pressure slurry plunger pump is described which provides a clean fluid buffer around the suction and discharge valves of the pump and in some cases in the vicinity of the plunger seal mechanism in order to displace erosive slurry material and thus extend the life of the pump and improve pump efficiency.

Claims (23)

1. A slurry plunger pump assembly comprising:

a. an inlet chamber connected to a slurry supply, said slurry comprised of a solid material and a slurry carrier fluid;

b. a suction valve, downstream of said inlet chamber, for admitting, fluids and solid materials into a head end of a pump cavity;

c. a plunger in said pump cavity for providing fluid movement and pressure;

d. a means for driving said plunger through a suction and discharge stroke cycle;

e. a seal mechanism attached at an opposed end of said pump cavity from said head end, contacting said plunger during movement;

f. a discharge valve connected to said pump cavity for discharging pressurized materials from said pump cavity;

g. a first clean fluid valve connected to a clean fluid supply, configured to supply clean fluid into the inlet chamber, upstream of the suction valve; and

h. a second clean fluid valve mechanism connected to a clean fluid supply configured to provide clean fluid into said pump cavity near said seal mechanism at said opposed end of said cylinder wherein said second clean fluid valve mechanism is responsive to said plunger's position and direction in said pump cavity.

2. The slurry plunger pump assembly of claim 1 wherein said clean first fluid valve is an automated control valve responsive to sensors indicating said plunger's position in said pump cavity.

3. The slurry plunger pump assembly of claim 1 wherein said slurry carrier fluid is selected from the group consisting of: a water based fluid, an oil based fluid, a liquified gas at pumping conditions, a solvent, an acid, or a base.

4. The slurry plunger pump assembly of claim 1 where said clean fluid is compatible with said slurry carrier fluid and is selected from the group consisting of: a water base fluid, an oil based fluid, a liquified gas at pumping condition, a solvent, an acid, or a base.

5. A slurry plunger pump assembly comprising:

a. an inlet chamber connected to a slurry supply, said slurry comprised of a solid material and a slurry carrier fluid;

b. a suction valve, downstream of said inlet chamber, for admitting fluids and solid materials into a head end of a pump cavity;

c. a plunger in said pump cavity for providing fluid movement and pressure;

d. a means for driving said plunger through a suction and discharge stroke cycle;

e. a seal mechanism attached at an opposed end of said pump cavity from said head end, contacting said plunger;

f. a discharge valve connected to said pump cavity for discharging pressurized materials from said pump cavity;

g. a first clean fluid valve connected to a clean fluid supply, configured to supply clean fluid into the inlet chamber; and

h. a second clean fluid valve mechanism connected to a clean fluid supply configured to provide clean fluid into said pump cavity near said seal mechanism at said opposed end of said cylinder wherein said second clean fluid valve mechanism is responsive to said plunger's position and direction in said pump cavity.

6. A slurry plunger pump assembly of claim 5 wherein said slurry carrier fluid is selected from the group consisting of: a water based fluid, an oil based fluid, a liquified gas at pumping conditions, a solvent, an acid, or a base.

7. A slurry plunger pump assembly of claim 5 wherein said clean fluid is compatible with said slurry carrier fluid and is selected from the group consisting of: a water base fluid, an oil based fluid, a liquified gas at pumping condition, a solvent, an acid, or a base.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 27, 2009
From: OGLESBY, KENNETH D.
To: REGENCY TECHNOLOGIES LLC
Reel/Frame 022151/0712 →
Continuity (1)
Related Publication 20080193299A1 · Aug 14, 2008