Non-vinyl flooring and method for making same
View Patent ↗In one embodiment or the present invention, a non-vinyl flooring is described comprising a flooring substrate having a non-vinyl composition comprising a terpolymer comprising ethylene, methyl acrylate and acrylic acid and a copolymer comprising ethylene and methacrylic acid. In one embodiment of the present invention, the non-vinyl flooring comprises a resilient non-vinyl floor tile comprising a non-vinyl composition comprising a terpolymer and a copolymer. In another embodiment of the present invention, the non-vinyl flooring comprises a resilient non-vinyl sheet flooring comprising a non-vinyl composition comprising a terpolymer and a copolymer. Methods for making the non-vinyl tile and non-vinyl sheet flooring are described.
1. A process for forming a non-vinyl flooring, comprising:
blending a terpolymer comprising ethylene, methyl acrylate and acrylic acid, a copolymer comprising ethylene and methacrylic acid and limestone to form a blended mixture;
heating said blended mixture to form a heated blended mixture;
forming a first sheet from said heated blended mixture
separating said first sheet into a plurality of pieces;
forming a second sheet from said plurality of pieces, wherein said second sheet has a predetermined thickness;
reducing said predetermined thickness of said second sheet; and
forming a smooth surface on a top surface of said second sheet.
2. The process of claim 1 , further comprising:
adding a plurality of pigmented particles to said plurality of pieces before said forming of said second sheet, wherein said forming of said second sheet thereby creates a mottle in said second sheet.
3. The process of claim 2 , further comprising:
adding a second plurality of pigmented particles to a top surface of said sheet prior to said reducing, wherein a second mottle is thereby created on said top surface of said sheet.
4. The process of claim 1 , wherein said heating is performed at approximately 350-370° F. utilizing a mixer, said forming of said first sheet is performed at approximately 260-340° F., said separating is performed at approximately 200-340° F., said forming of said second sheet is performed at approximately 260-340° F., said reducing of said predetermined thickness and said forming of said smooth surface are performed at approximately 55-340° F., and said cutting is performed at approximately 90-100° F.
5. The process of claim 1 , further comprising laminating a backing substrate to said second sheet, thereby forming a sheet flooring.
6. The process of claim 1 , further comprising cutting said second sheet into a plurality of tiles.