Electronic assembly for image sensor device and fabrication method thereof
A package module for an image sensor device is disclosed. The package module comprises a device chip disposed between lower and upper substrates. A first conductive layer is over a first sidewall of the lower substrate and insulated from the device chip. A first protective layer is on the first conductive layer and exposes a portion of the first conductive layer over the first sidewall of the lower substrate. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.
1. A package module for an image sensor device, comprising:
a lower substrate and an upper substrate opposite thereto;
a device chip disposed between the lower and upper substrates;
a first conductive layer over a first sidewall of the lower substrate, insulated from the device chip;
a first protective layer on the first conductive layer, exposing a portion of the first conductive layer over the first sidewall of the lower substrate; and
a first pad on the bottom surface of the lower substrate, electrically connected to the first conductive layer.
2. The package module as claimed in claim 1 , further comprising a spacer disposed between the device chip and the upper substrate to form a cavity therebetween.
3. The package module as claimed in claim 1 , further comprising a solder ball disposed on the first pad.
4. The package module as claimed in claim 1 , further comprising g:
a grounding pad on the device chip;
a second pad on the bottom surface of the lower substrate;
a second conductive layer over a second sidewall of the lower substrate, electrically connected between the grounding pad and the second pad; and
a second protective layer on the second conductive layer over the second sidewall of the lower substrate.
5. The package module as claimed in claim 4 , further comprising a solder ball disposed on the second pad.
6. The package module as claimed in claim 4 , wherein the first and second conductive layers and the first and second pads comprise a multi-layer structure, respectively.
7. The package module as claimed in claim 1 , further comprising an epoxy layer disposed between the device chip and the lower substrate.
8. The package module as claimed in claim 1 , wherein the device chip comprises a CCD or CMOS image sensor chip.
9. An electronic assembly for an image sensor device, comprising:
a package module, comprising:
a lower substrate and an upper substrate opposite thereto;
a device chip disposed between the lower and upper substrates;
a first conductive layer over a first sidewall of the lower substrate, insulated from the device chip unless the first conductive layer is electrically connected to a printed circuit board;
a first protective layer on the first conductive layer, exposing a portion of the first conductive layer over the first sidewall of the lower substrate; and
a first pad on the bottom surface of the lower substrate, electrically connected to the first conductive layer;
a lens set mounted on the package module; and
an opaque conductive layer disposed on the sidewall of the lens set and electrically connected to the first conductive layer.
10. The electronic assembly as claimed in claim 9 , wherein the opaque conductive layer comprises metal.
11. The electronic assembly as claimed in claim 9 , wherein the opaque conductive layer directly contacts the exposed portion of the first conductive layer.
12. The electronic assembly as claimed in claim 9 , further comprising the printed circuit board mounted to the package module, comprising a grounding layer therein.
13. The electronic assembly as claimed in claim 12 , further comprising a solder ball disposed on the first pad and electrically connected to the grounding layer.
14. The electronic assembly as claimed in claim 12 , wherein the package module further comprises:
a grounding pad on the device chip;
a second pad on the bottom surface of the lower substrate;
a second conductive layer over a second sidewall of the lower substrate, electrically connected between the grounding pad and the second pad; and
a second protective layer on the second conductive layer over the second sidewall of the lower substrate.
15. The electronic assembly as claimed in claim 14 , further comprising a solder ball disposed on the second pad and electrically connected to the grounding layer.
16. The package module as claimed in claim 14 , wherein the first and second conductive layers and the first and second pads comprise a multi-layer structure, respectively.
17. The electronic assembly as claimed in claim 9 , wherein the package module further comprises an epoxy layer disposed between the device chip and the lower substrate.
18. The electronic assembly as claimed in claim 9 , wherein the package module further comprises a spacer disposed between the device chip and the upper substrate to form a cavity therebetween.
19. The electronic assembly as claimed in claim 9 , wherein the device chip comprises a CCD or CMOS image sensor chip.
20. A method for fabricating an electronic assembly for an image sensor device, comprising:
providing a package module, comprising:
a lower substrate and an upper substrate opposite thereto;
a device chip disposed between the lower and upper substrates;
a first conductive layer over a first sidewall of the lower substrate, insulated from the device chip;
a first protective layer on the first conductive layer; and
a first pad on the bottom surface of the lower substrate, electrically connected to the first conductive layer;
partially removing the first protective layer to expose a portion of the first conductive layer over the first sidewall of the lower substrate;
mounting a lens set onto the package module;
forming an opaque conductive layer on the sidewall of the lens set and directly on the exposed portion of the first conductive layer; and
mounting the package module with the lens set on a printed circuit board comprising a grounding pad therein.
21. The method as claimed in claim 20 , wherein the opaque conductive layer comprises metal.
22. The method as claimed in claim 20 , further forming a solder ball between the first pad and the printed circuit board and electrically connected to the grounding layer.
23. The method as claimed in claim 20 , wherein the package module further comprises:
a grounding pad on the device chip;
a second pad on the bottom surface of the lower substrate;
a second conductive layer over a second sidewall of the lower substrate, electrically connected between the grounding pad and the second pad; and
a second protective layer on the second conductive layer over the second sidewall of the lower substrate.
24. The method as claimed in claim 23 , further forming a solder ball between the second pad and the printed circuit board and electrically connected to the grounding layer.
25. The package module as claimed in claim 23 , wherein the first and second conductive layers and the first and second pads comprise a multi-layer structure, respectively.
26. The method as claimed in claim 20 , wherein the package module further comprises an epoxy layer disposed between the device chip and the lower substrate.
27. The method as claimed in claim 20 , wherein the package module further comprises a spacer disposed between the device chip and the upper substrate to form a cavity therebetween.
28. The method as claimed in claim 20 , wherein the device chip comprises a CCD or CMOS image sensor chip.