Method for producing reflective layers in LCD display
A method for producing a light reflecting structure in a transflective or reflective liquid crystal display uses one or two masks for masking a photoresist layer in a back-side exposing process. The pattern on the masks is designed to produce rod-like structures or crevices and holes on exposed and developed photoresist layer. After the exposed photoresist is developed, a heat treatment process or a UV curing process is used to soften the photoresist layer so that the reshaped surface is more or less contiguous but uneven. A reflective coating is then deposited on the uneven surface. One or more intermediate layers can be made between the masks, between the lower mask and the substrate, and between the upper masks and the photoresist layers. The masks and the intermediate layers can be made in conjunction with the fabrication of the liquid crystal display panel.
1. A method for producing a light reflective structure on a substrate in a liquid crystal display panel, comprising:
forming a first mask on the substrate, the first mask having first light-blocking areas and first non-light blocking areas;
disposing one or more intermediate layers over the first mask, wherein the intermediate layers are made of one or more materials different from the first mask;
forming a second mask over the intermediate layers, wherein the second mask has second light-blocking areas at least partially different from the first light-blocking areas;
disposing a photoresist layer on the second mask;
exposing the photoresist layer through the first mask and the second mask for providing an exposed photoresist layer having exposed layer areas;
developing the exposed photoresist layer for producing an uneven surface;
reshaping the uneven surface for producing a reshaped surface; and
disposing a light reflective coating on the reshaped surface.
2. The method of claim 1 , further comprising:
disposing one or more intermediate layers between the substrate and the first mask, wherein the intermediate layers are made of one or more materials different from the first mask.
3. The method of claim 1 , wherein said reshaping comprises a heating process for softening the photoresist layer.
4. The method of claim 1 , wherein said reshaping comprises a UV curing process for softening the photoresist layer.
5. The method of claim 1 , wherein the first mask is made of a metal coating.
6. The method of claim 1 , wherein the intermediate layers comprises a dielectric layer.
7. The method of claim 1 , wherein the intermediate layers comprises an amorphous silicon layer.
8. The method of claim 1 , wherein the second mask is made of a metal coating.
9. The method of claim 1 , further comprising:
disposing one or more different intermediate layers between the photoresist layer and the second mask.
10. The method of claim 9 , wherein the one or more different intermediate layers comprises an electrically conductive layer.
11. The method of claim 9 , wherein the one or more different intermediate layers comprises a passivation layer.
12. The method of claim 1 , wherein the first non-light blocking areas and the second non-light blocking areas are arranged such that at least part of the uneven surface comprises a plurality of discrete pieces of photoresist material.
13. The method of claim 1 , wherein the first non-light blocking areas and the second non-light blocking areas are arranged such that at least part of the uneven surface comprises a plurality of holes.