Trench MOS Schottky barrier rectifier with high k gate dielectric and reduced mask process for the manufacture thereof
View Patent ↗A trench MOS Schottky barrier device has a metal oxide gate dielectric such as TiSi lining the trench wall to increase the efficiency of the elemental cell and to improve depletion in the mesa during reverse bias. A reduced mask process is used in which a single layer of titanium or other metal is deposited on an underlying gate oxide layer on the trench walls and directly atop the mesa between adjacent trenches. A common thermal treatment causes the Ti to diffuse into the SiO 2 gate oxide to form the TiO 2 gate and to form the TiSi Schottky barrier on the top surface of the mesa.
1. A trench type Schottky barrier device having a high dielectric layer lining trenches of said trench type Schottky barrier device, wherein dielectric constant of said high dielectric layer is greater than that of silicon dioxide.
2. The trench type Schottky barrier device of claim 1 , wherein said high dielectric is a metal oxide.
3. The trench type Schottky barrier device of claim 2 , wherein said metal oxide is a titanium oxide.
4. A reduced mask process for the manufacture of a trench type Schottky barrier type device wherein a silicide forming metal is applied both to device mesas and to a gate oxide lining an interior of device trenches and a subsequent thermal treatment step simultaneously convert said metal to a silicide Schottky barrier on the device mesas of the trench type Schottky barrier type device and to convert the gate oxide to a high dielectric metal oxide.
5. A process for forming a high dielectric oxide layer on walls of a trench in a silicon wafer, comprising: forming a silicon dioxide layer on said walls; applying a metal over said silicon dioxide layer; and thermally treating silicon dioxide layer to cause said metal to diffuse into said silicon dioxide to form a metal oxide of increased dielectric constant of said high dielectric oxide layer as compared to that of silicon dioxide.