IP Library Granted Patent US 7,695,806
Granted Patent B2
US 7,695,806 · App. 11/710,427 · Granted Apr 13, 2010

Moulding composition for producing bipolar plates

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Quick Facts
Patent No.
US 7,695,806
App. No.
11/710,427
Granted
Apr 13, 2010
Kind
B2
Abstract

Compositions comprising (a) an epoxy resin, (b) a hardener for the epoxy resin, (c) a product of the reaction of a microgel containing carboxylic acid groups and a nitrogen-containing base, and (d) an electrically conducting filler combination comprising, based on the total amount of filler, at least 75% by weight of graphite, are particularly suitable for producing biopolar plates.

Claims (26)

1. A solvent-free composition consisting essentially of:

(a) an epoxy resin,

(b) a hardener for the epoxy resin,

(c) a product of the reaction of a microgel containing carboxylic acid groups and a nitrogen-containing base, selected from the group consisting of an amine, a polyamine and an imidazole, and

(d) an electrically conducting filler combination comprising, based on the total amount of filler, at least 75% by weight of graphite.

2. The composition according to claim 1 , wherein component (a) is a solid ether-based epoxy resin.

3. The composition according to claim 1 , wherein component (a) is an epoxy phenol novolak or an epoxy cresol novolak.

4. The composition according to claim 1 , wherein the microgel in component (c) is a copolymer of at least one unsaturated carboxylic acid and at least one polyfunctional crosslinker.

5. The composition according to claim 4 , wherein the unsaturated carboxylic acid is acrylic acid or methacrylic acid.

6. The composition according to claim 4 , wherein the polyfunctional crosslinker is a polyfunctional acrylate or methacrylate of an aliphatic, cycloaliphatic or aromatic polyol, an addition product of acrylic acid or methacrylic acid and a polyglycidyl compound, an addition product of acrylic acid or methacrylic acid and glycidyl acrylate or methacrylate, an alkenyl acrylate or alkenyl methacrylate, a dialkenylcyclohexane, or a dialkenylbenzene.

7. The composition according to claim 4 , wherein the polyfunctional crosslinker is selected from the group consisting of ethylene glycol diacrylate, ethylene glycol dimethacrylate, propylene glycol diacrylate, propylene glycol dimethacrylate, 1,4-butanediol diacrylate, 1,4-butanediol dimethacrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, polypropylene glycol diacrylate, polypropylene glycol dimethacrylate, 1,1,1-trimethylolpropane triacrylate, 1,1,1-trimethylolpropanetrimethacrylate, bisphenol A diglycidyl ether diacrylate, bisphenol A diglycidyl ether dimethacrylate, allyl acrylate, allyl methacrylate, divinylcyclohexane, and divinylbenzene.

8. The composition according to claim 1 , wherein the nitrogen-containing base is 2-phenylimidazole, 2-isopropylimidazole, 2-dodecylimidazole, 2-heptadecylimidazole, 2-ethyl imidazole, or 2-ethyl-4-methylimidazole.

9. The composition according to claim 1 , wherein the filler combination (d) comprises graphite powder with an average particle diameter of from 0.1 to 500 μm.

10. The composition according to claim 9 , wherein the filler combination (d) comprises graphite powder with an average particle diameter of from 1 to 300 μm.

11. The composition according to claim 10 , wherein the filler combination (d) comprises graphite powder with an average particle diameter of from 10 to 250 μm.

12. The composition according to claim 11 , wherein the filler combination (d) comprises graphite powder with an average particle diameter of from 50 to 100 μm.

13. The composition according to claim 1 , wherein the filler combination (d) comprises graphite powder in the form of synthetic graphite.

14. The composition according to claim 1 , wherein component (b) is provided at from 20 to 75 parts by weight, based on 100 parts by weight of component (a).

15. The composition according to claim 1 , wherein component (c) is provided at from 0.1 to 25 parts by weight, based on 100 parts by weight of component (a).

16. The composition according to claim 1 , wherein component (d) is provided at from 50 to 90% by weight, based on the entire composition of components (a)+(b)+(c)+(d).

17. The composition according to claim 16 , wherein component (d) is provided at from 70 to 85% by weight, based on the entire composition of components (a)+(b)+(c)+(d).

18. The composition according to claim 1 , further comprising an organosilane.

19. The composition according to claim 18 , wherein the organosilane is provided at from 0.05 to 1 parts by weight, based on the entire composition.

20. The composition according to claim 19 , wherein the organosilane is provided at from 0.1 to 0.5 parts by weight, based on the entire composition.

21. An electrically conductive material produced by hardening a composition according to claim 1 .

22. A process for the production of bipolar plates comprising applying the technique of injection molding, transfer molding or compression molding to form a bipolar plate from the composition of claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 30, 2007
From: HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH; HUNTSMAN ADVANCED MATERIALS AMERICAS INC.
To: DURESCO GMBH
Reel/Frame 019247/0783 →