IP Library Granted Patent US 7,840,191
Granted Patent B2
US 7,840,191 · App. 11/712,682 · Granted Nov 23, 2010

Baluns for multiple band operation

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Quick Facts
Patent No.
US 7,840,191
App. No.
11/712,682
Granted
Nov 23, 2010
Kind
B2
Abstract

A small size, low cost balun is formed on a substrate, such as gallium arsenide, as an integrated passive device. Multiple baluns are formed on a same substrate, allowing multi-band operation. For example, symmetrical transformers are provided for two different bands of operation, such as for a quad-band GSM application. Each of the two different baluns is used for two different frequency bands of operation of the quad-band device. A ground ring allows two Hi-Q baluns to be formed on the same integrated circuit side-by-side with minimum spacing and minimum impact on phase and amplitude performance over the frequency bands of operation. By using multiple integrated circuit baluns on a same substrate or chip, the size and cost of baluns for multi-band operation may be reduced.

Claims (28)

1. A transmitter or receiver system for transforming signals, the system comprising:

a transmitter or receiver having first and second pairs of ports;

first and second transformers of a same chip, the first transformer connected with the first pair of ports and the second transformer connected with the second pair of ports, and

an isolation line around at least part of each of the first and second transformers and at least in part between the first and second transformers in a circuit plane.

2. The system of claim 1 wherein the transmitter or receiver comprises a multi-band mobile phone component.

3. The system of claim 1 wherein the first pair of ports is a first differential output pair and the second pair of ports is a second differential output pair, the first and second transformers each having differential inputs with single ended outputs.

4. The system of claim 3 wherein the first and second transformer comprise gallium arsenide.

5. The system of claim 3 wherein the first and second transformer comprise silicon.

6. The system of claim 1 wherein the first and second transformers are located within about 100 microns of each other.

7. The system of claim 1 wherein the chip is flip-chip bonded to the transmitter or receiver.

8. The system of claim 1 wherein the transmitter or receiver comprises a quad-band mobile telephone.

9. The system of claim 8 wherein the first transformer is sized to provide optimum frequency response in a cellular band.

10. The system of claim 8 wherein the first transformer is sized to provide optimum frequency response in a EGSM band.

11. The system of claim 8 wherein the first transformer is sized to provide optimum frequency response in a cellular band and a EGSM band.

12. The system of claim 1 wherein the first and second transformer comprise gallium arsenide.

13. The system of claim 1 wherein the first and second transformer comprise silicon.

14. The system of claim 1 wherein the first transformer is configured for a higher frequency band than the second transformer.

15. The system of claim 1 wherein one of the first or second transformers is sized for a center frequency of about 866 Megahertz.

16. The system of claim 15 wherein the other transformer is sized for a center frequency of about 1,807 Megahertz.

17. The transmitter or receiver system of claim 1 , wherein the isolation line also extends around at least a part of the first or second transformers in a plane that is not parallel to the circuit plane.

18. A transmitter or receiver system for transforming signals, the system comprising:

a transmitter or receiver having first and second pairs of ports;

a first transformer configured for a first frequency band and connected with the first pair of ports;

a second transformer configured for a second frequency band and connected with the second pair of ports; and

a ground line around at least one of the first and second transformers,

wherein the first transformer and the second transformer are on the same chip and a center frequency of the first frequency band is higher than a center frequency of the second frequency band.

19. The system of claim 18 wherein the transmitter or receiver comprises a multi-band mobile phone component.

20. The system of claim 18 wherein the first pair of ports is a first differential output pair and the second pair of ports is a second differential output pair, the first and second transformers each having differential inputs with single ended outputs.

Assignments (26)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 22, 2017
From: HISILICON TECHNOLOGIES CO., LTD.
To: HUAWEI TECHNOLOGIES CO.,LTD.
Reel/Frame 043918/0767 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2016
From: NANJING TRIDUCTOR NETWORK TECHNOLOGY CO., LTD.
To: HISILICON TECHNOLOGIES CO., LTD.
Reel/Frame 040531/0599 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0553 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0640 →
RELEASE OF SECURITY INTEREST Recorded Nov 26, 2013
From: CITIBANK, N.A.
To: FREESCALE SEMICONDUCTOR, INC.; FREESCALE ACQUISITION CORPORATION; FREESCALE ACQUISITION HOLDINGS CORP.; FREESCALE HOLDINGS (BERMUDA) III, LTD.
Reel/Frame 031681/0276 →
RELEASE OF SECURITY INTEREST Recorded Nov 1, 2013
From: CITIBANK, N.A.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 031526/0828 →
RELEASE OF SECURITY INTEREST Recorded Nov 1, 2013
From: CITIBANK, N.A.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 031526/0965 →
RELEASE OF SECURITY INTEREST Recorded Nov 1, 2013
From: CITIBANK, N.A.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 031527/0114 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 29, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: NANJING TRIDUCTOR NETWORK TECHNOLOGY CO., LTD.
Reel/Frame 031499/0084 →