Electronic component integrated module
The electronic component integrated module includes a wiring board; an electronic component provided on the wiring board; solder for electrically connecting the electronic component onto the wiring substrate; and an encapsulating resin for encapsulating the electronic component and the solder. The average linear thermal expansion coefficient α of the encapsulating resin, which is calculated by using the glass transition temperature of the encapsulating resin, a linear thermal expansion coefficient α1 obtained at a temperature lower than the glass transition temperature, a linear thermal expansion coefficient α2 obtained at a temperature exceeding the glass transition temperature, room temperature, and a peak temperature of reflow packaging of the electronic component integrated module, is not less than 17×10 −6 /° C. and not more than 110×10 −6 /° C.
1. An electronic component integrated module comprising:
a wiring board;
an electronic component provided on said wiring board;
solder for electrically connecting said electronic component onto said wiring board; and
an encapsulating resin provided on said wiring board for encapsulating said electronic component and said solder, wherein:
an average linear thermal expansion coefficient α of said encapsulating resin calculated by the following Formula 1 is not less than 17×10 −6 /° C. and not more than 110×10 −6 /° C.:
α={α1×( Tg−Tr )+α2×( Tp−Tg )}/( Tp−Tr ), where Formula 1
α1 indicates a linear thermal expansion coefficient of said encapsulating resin obtained at a temperature lower than a glass transition temperature thereof;
α2 indicates a linear thermal expansion coefficient of said encapsulating resin obtained at a temperature exceeding the glass transition temperature;
Tg indicates the glass transition temperature of said encapsulating resin;
Tr indicates room temperature; and
Tp indicates a peak temperature of packaging of said electronic component integrated module, and
the Tg in the Formula 1 is 35° C. or more and 94° C. or less.
2. The electronic component integrated module of claim 1 ,
wherein said electronic component is a surface mount electronic component in the shape of a chip and is at least one of a capacitor, a resistor and a coil.
3. The electronic component integrated module of claim 1 ,
wherein said encapsulating resin includes an inorganic filler, and
a content of said inorganic filler in said encapsulating resin is not less than 70% and not more than 90% based on a mass thereof.
4. The electronic component integrated module of claim 1 ,
wherein said encapsulating resin has a viscosity not less than 50 Pa·s and not more than 100 Pa·s and has a thixotropic ratio not less than 0.8 and not more than 1.5 at a temperature of 25° C.
5. The electronic component integrated module of claim 1 ,
wherein said encapsulating resin includes at least one of an epoxy resin and a silicone resin.
6. The electronic component integrated module of claim 1 ,
wherein said wiring board is an organic wiring board.
7. The electronic component integrated module of claim 1 ,
wherein said wiring board is a ceramic wiring board.
8. The electronic component integrated module of claim 1 , wherein the average linear thermal expansion coefficient α of said encapsulating resin calculated by the Formula 1 is not less than 44×10 −6 /° C. and not more than 77×10 −6 /° C.
9. The electronic component integrated module of claim 1 , wherein the solder covers at least a part of an upper surface of the electronic component.
10. The electronic component integrated module of claim 3 ,
wherein said inorganic filler is at least one of Al 2 O 3 , MgO, BN, AlN and SiO 2 .
11. The electronic component integrated module of claim 5 , wherein:
the encapsulating resin is an epoxy resin, and
the epoxy resin includes at least one of a bisphenol A type resin, a bisphenol F type resin, a biphenyl type resin and a naphthalene type resin.