Photoelectric conversion device and image sensor
View Patent ↗A photoelectric conversion device ( 10 ) includes a first conductivity type first semiconductor region ( 10 a ) located in a pixel region ( 11 ), a second conductivity type second semiconductor region ( 12 ) provided in the first semiconductor region ( 10 a ), for storing a signal charge, interconnecting portions ( 13 and 14 ) for connecting the second semiconductor region ( 12 ) with a circuit element provided outside the pixel region ( 11 ), and an organic film ( 16 ) which is provided above a portion located in the pixel region ( 11 ) in the interconnecting portions ( 13 and 14 ) through an insulating protective film ( 15 ) and held at a predetermined potential. The organic film ( 16 ) is made of a thermoplastic polyimide resin containing one of a conductive particle and a conductive fiber.
1. A photoelectric conversion device, comprising:
a first semiconductor region of a first conductivity type which is located in a pixel region;
a second semiconductor region of a second conductivity type which is provided in the first semiconductor region, for storing a signal charge;
a interconnecting portion for connecting the second semiconductor region with a circuit element provided outside the pixel region;
an organic film provided above the interconnecting portion through an insulating protective film;
a pixel separation region above a portion of the first semiconductor region, the pixel separation region comprising one of a P+ type region and a N+ type region; and
a light shielding layer above the pixel separation region,
wherein the organic film comprises a thermoplastic polyimide resin containing one of a conductive particle and a conductive fiber, and
wherein a distance between an upper surface of the organic film and an upper surface of the interconnecting portion is between approximately 3 μm and approximately 11.5 μm.
2. An image sensor, comprising:
a photoelectric conversion device;
a light source for emitting light to an object; and
an imaging element for condensing light reflected from the object and imaging the reflected light into the photoelectric conversion device,
wherein the photoelectric conversion device comprises the photoelectric conversion device according to claim 1 .
3. The photoelectric conversion device of claim 1 , the organic film comprising a thickness of between approximately 2 μm and approximately 10 μm.
4. The photoelectric conversion device of claim 1 , further comprising an insulating protective film between the organic film and the interconnecting portion.
5. The photoelectric conversion device of claim 4 , where a distance between an upper surface of the insulating protective film and an upper surface of the interconnecting portion is between approximately 1 μm and approximately 1.5 μm.
6. The photoelectric conversion device of claim 4 , where the organic film is positioned above a portion of the insulating protective film.
7. The photoelectric conversion device of claim 4 , where the organic film is positioned above an entire upper surface of the insulating protective film.
8. The photoelectric conversion device of claim 1 , where the interconnecting region comprises:
a metal interconnecting line; and
an interconnect semiconductor region below the metal interconnecting line, the interconnect semiconductor region comprising one of an N+ type region and a P+ type region.