Electronic circuit package
View Patent ↗An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting faults of the processor.
1. A semiconductor multi-chip module, comprising:
a substrate;
at least one first chip mounted on one side of substrate, the first chip sending and receiving one part of data being sent and received by the semiconductor multi-chip module, and
at least one second chip mounted on the other side of said substrate, the second chip sending and receiving the other part of the data being sent and received by the semiconductor multi-chip module.
2. A semiconductor multi-chip module according to claim 1 , wherein a plurality of lines includes first lines provided exclusively on the one side of said substrate and second lines provided exclusively on the other side of said substrate,
wherein said first lines are connected to said first chip, and
wherein said second lines are connected to said second chip.
3. A semiconductor multi-chip module according to claim 2 , wherein said plurality of lines is data lines.