IP Library Granted Patent US 7,591,201
Granted Patent B1
US 7,591,201 · App. 11/716,285 · Granted Sep 22, 2009

MEMS structure having a compensated resonating member

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Quick Facts
Patent No.
US 7,591,201
App. No.
11/716,285
Granted
Sep 22, 2009
Kind
B1
Abstract

A MEMS structure having a compensated resonating member is described. In an embodiment, a MEMS structure comprises a resonating member coupled to a substrate by an anchor. A dynamic mass-load is coupled with the resonating member. The dynamic mass-load is provided for compensating a change in frequency of the resonating member by altering the moment of inertia of the resonating member by way of a positional change relative to the anchor.

Claims (25)

1. A MEMS structure, comprising:

a cantilever resonating member;

an anchor to couple said cantilever resonating member with a substrate; and

a dynamic mass-load coupled with said cantilever resonating member, wherein said dynamic mass-load is for compensating a change in frequency of said cantilever resonating member by altering the moment of inertia of said cantilever resonating member by way of a positional change relative to said anchor.

2. The structure of claim 1 , wherein said dynamic mass-load is for compensating said cantilever resonating member in response to a change in temperature.

3. The structure of claim 1 , wherein said dynamic mass-load is for altering the moment of inertia of said cantilever resonating member by deformation due to a TCE mismatch.

4. The structure of claim 3 wherein said TCE mismatch is at least 1.0×10 −6 /° C.

5. The structure of claim 3 , wherein said dynamic mass-load comprises a multi-component arm coupled with said cantilever resonating member, and a mass-system coupled with said multi-component arm.

6. The structure of claim 5 , wherein said multi-component arm is coupled orthogonally with said cantilever resonating member approximately at the center of said multi-component arm, and wherein said mass-system comprises two suspended mass-units, with one suspended mass-unit on either end of said multi-component arm.

7. The structure of claim 5 , wherein said multi-component arm is a two-component arm, each component consisting of a material having a different TCE than the material of the other component.

8. The structure of claim 7 , wherein one of the components consists of the same material as the material of said cantilever resonating member.

9. The structure of claim 5 , wherein said multi-component arm is a three-component arm, each component consisting of a material having a different TCE than the materials of the other components.

10. The structure of claim 9 , wherein one of the components consists of the same material as the material of said cantilever resonating member.

11. The structure of claim 2 , wherein said dynamic mass-load is configured to decrease the moment of inertia of said cantilever resonating member in response to an increase in temperature.

12. The structure of claim 2 , wherein said dynamic mass-load is configured to increase the moment of inertia of said cantilever resonating member in response to an increase in temperature.

13. A MEMS structure, comprising:

a resonator member disposed above a substrate;

an anchor disposed between and end of said resonator member and said substrate, and coupled with both said end of said resonator member and said substrate;

a mass-load comprising a multi-component arm coupled with said resonator member; and

a pair of electrodes, each electrode coupled with said substrate and disposed on an opposing side of said resonator member, between said anchor and said mass-load.

14. The structure of claim 13 , wherein said multi-component arm is coupled orthogonally with said resonator member, approximately at the center of said multi-component arm.

15. The structure of claim 13 , wherein said multi-component arm is a two-component arm, each component consisting of a material having a different TCE than the material of the other component, and one of one of the components consisting of the same material as the material of said resonator member.

16. The structure of claim 13 , wherein said multi-component arm is a three-component arm, each component consisting of a material having a different TCE than the materials of the other components, and one of the components consisting of the same material as the material of said resonator member.

17. The structure of claim 13 , wherein said resonator member comprises silicon/germanium, and wherein said multi-component arm comprises silicon/germanium and silicon dioxide.

18. The structure of claim 13 , wherein said resonator member is a cantilever.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2010
From: SILICON LABS SC, INC.
To: SILICON LABORATORIES INC.
Reel/Frame 025366/0466 →
CHANGE OF NAME Recorded May 4, 2010
From: SILICON CLOCKS, INC.
To: SILICON LABS SC, INC.
Reel/Frame 024369/0134 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2007
From: BERNSTEIN, DAVID H.; HOWE, ROGER T.; QUEVY, EMMANUEL P.
To: SILICON CLOCKS, INC.
Reel/Frame 019053/0881 →