Electronic device and method of manufacturing the same, circuit board, and electronic instrument
View Patent ↗An electronic device includes: a substrate on which an interconnect pattern is formed; a chip component having a first surface on which an electrode is formed and a second surface opposite to the first surface, the chip component being mounted in such a manner that the second surface faces the substrate; an insulating section formed of a resin and provided adjacent to the chip component; and an interconnect which is formed to extend from above the electrode, over the insulating section and to above the interconnect pattern.
1. An electronic device comprising:
a substrate on which an interconnect pattern is formed;
a chip component that has a first surface on which an electrode and an insulating film are formed and a second surface opposite to the first surface, the chip component being mounted in such a manner that the second surface faces the substrate, the insulating film having an aperture on at least a part of the electrode;
an insulating section that is provided adjacent to the chip component, the insulating section being formed in such a manner that a part of the insulating section overlaps the first surface and is disposed on the insulating film, the insulating section having an inclined surface descending in an outward direction from the chip component, the insulating section having a convex surface connected to the inclined surface, the convex surface being curved; and
an interconnect that is formed to extend from above the electrode, to above the interconnect pattern, the interconnect being formed over the insulating section.
2. The electronic device as defined by claim 1 ,
wherein a side surface of the chip component is inclined to descend in an outward direction from the first surface.
3. The electronic device as defined by claim 1 ,
wherein the chip component has a step in an edge portion of the chip component.
4. The electronic device as defined by claim 1 ,
wherein the insulating section has a portion higher than the first surface.
5. The electronic device as defined by claim 1 , further comprising:
a connection layer that connects the chip component with the substrate.
6. The electronic device as defined by claim 5 ,
wherein the connection layer is formed of the same material as the insulating section.
7. The electronic device as defined by claim 5 ,
wherein the connection layer is formed of a material different from a material of the insulating section.
8. The electronic device as defined by claim 1 ,
wherein the insulating section is formed of a resin.
9. The electronic device as defined by claim 1 , wherein a first portion of the interconnect is disposed on the insulating section.
10. The electronic device as defined by claim 9 , wherein a second portion of the interconnect is disposed on the insulating layer, and a first adhesiveness between the insulating section and the interconnect is higher than a second adhesiveness between the insulating film and the interconnect.