IP Library Granted Patent US 7,864,488
Granted Patent B1
US 7,864,488 · App. 11/717,299 · Granted Jan 4, 2011

Suspension assembly including a dimple that contacts a flexure tongue dielectric layer through a hole in a flexure tongue structural layer

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Quick Facts
Patent No.
US 7,864,488
App. No.
11/717,299
Granted
Jan 4, 2011
Kind
B1
Abstract

A suspension assembly includes a load beam having a protruding dimple and a laminate flexure. The laminate flexure includes a structural layer that is attached to the load beam, and a dielectric layer. The laminate flexure includes a flexure tongue for mounting a head. The flexure tongue includes the structural layer and the dielectric layer and a hole that extends through the structural layer but not through the dielectric layer. The dimple contacts the dielectric layer via the hole.

Claims (23)

1. A suspension assembly comprising:

a load beam including a protruding dimple; and

a laminate flexure including a structural layer that is attached to the loadbeam, and a dielectric layer, the laminate flexure including a flexure tongue for mounting a head;

wherein the flexure tongue includes the structural layer and the dielectric layer and a hole that extends through the structural layer but not through the diectric layer, and wherein the dimple contacts the dielectric layer via the hole.

2. The suspension assembly of claim 1 wherein the laminate flexure further comprises an electrically conductive layer on a side of the dielectric layer that is opposite the structural layer.

3. The suspension assembly of claim 1 wherein the dielectric layer comprises polyimide and the structural layer comprises stainless steel.

4. The suspension assembly of claim 1 wherein the dimple has a protrusion height in the range 65 to 90 microns.

5. The suspension assembly of claim 1 wherein the hole has a diameter that is at least 260 microns.

6. The suspension assembly of claim 1 wherein the loadbeam comprises stainless steel.

7. The suspension assembly of claim 1 wherein the dielectric layer has a material tensile modulus that is at least 2.5 GPa.

8. A head gimbal assembly (HGA) comprising:

a head including a read transducer;

a load beam including a protruding dimple; and

a laminate flexure including a structural layer that is attached to the loadbeam, and a dielectric layer, the laminate flexure including a flexure tongue on which the head is mounted;

wherein the flexure tongue includes the structural layer and the dielectric layer, and a hole that extends through the structural layer but not through the diectric layer, and wherein the dimple contacts the dielectric layer via the hole.

9. The HGA of claim 8 wherein the laminate flexure further comprises an electrically conductive layer on a side of the dielectric layer that is opposite the structural layer.

10. The HGA of claim 9 wherein the head is in mounted to the flexure tongue in contact with the electrically conductive layer.

11. The HGA of claim 8 wherein the dielectric layer comprises polyimide and the structural layer comprises stainless steel.

12. The HGA of claim 8 wherein the loadbeam comprises stainless steel.

13. The HGA of claim 8 wherein the head is mounted to the flexure tongue in contact with the dielectric layer.

14. The HGA of claim 8 wherein the dimple has a protrusion height in the range 65 to 90 microns.

15. The HGA of claim 8 wherein the hole has a diameter that is at least 260 microns.

16. The HGA of claim 8 wherein the dielectric layer has a material tensile modulus that is at least 2.5 GPa.

Assignments (8)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 038744 FRAME 0481 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058982/0556 →
RELEASE OF SECURITY INTEREST Recorded Mar 5, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 045501/0714 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038744/0281 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038722/0229 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038744/0481 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 13, 2007
From: PAN, TZONG-SHII
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 019089/0089 →