IP Library Patent Application 11720766
Patent Application
App. No. 11/720,766

INTER-BOARD COUPLING CONNECTOR AND CIRCUIT BOARD DEVICE USING INTER-BOARD COUPLING CONNECTOR

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Quick Facts
Patent No.
US None
App. No.
11/720,766
Abstract

An object of the invention is to provide the effects of suppressing noise radiated from a plurality of coupling terminals for coupling between boards to the peripheral space outside of an inter-board coupling connector. Two boards opposing to each other are electrically coupled by coupling terminals ( 3 a ), ( 3 b ), ( 3 c ) and these coupling terminals are molded by insulative resin to form in a frame shape. When an electric signal passes through the coupling terminals ( 3 a ), ( 3 b ), ( 3 c ), the noise radiated in the peripheral space of the outside can be suppressed by a shield plate ( 4 a ), ( 4 b ) attached to the outer periphery of the resin.

Claims (13)

1 . An inter-board coupling connector comprising:

an inter-board coupling connector main body in which two boards opposing to each other are electrically coupled by a plurality of coupling terminals and the plurality of coupling terminals are molded by insulative resin to form a frame-shaped housing; and

a shield plate provided at an outer periphery of the inter-board coupling connector main body, thereby to provide an electric shielding property between the plurality of coupling terminals and an outside of the inter-board coupling connector main body, wherein

each of the plurality of coupling terminals is formed by a single metal piece in a manner that each coupling terminal has flat portions to be joined to the two boards opposing to each other, respectively, and the flat portions protrude from the housing.

2 . The inter-board coupling connector according to claim 1 , wherein a space serving as a solder width is provided between the flat portion of the coupling terminal and the housing.

3 . The inter-board coupling connector according to claim 1 , wherein the coupling terminal is formed by phosphor bronze which is subjected to a nickel plating to form a lower layer and subjected to a tin plating to form a major surface layer, and liquid crystal polymer (LCP) is used as the resin.

4 . A circuit board device comprising:

the inter-board coupling connector according to claim 1 ;

a first printed board on which electronic parts are mounted within the frame of the inter-board coupling connector; and

a second printed board disposed in opposite to the first printed boards and coupled thereto via the inter-board coupling connector, wherein

a wiring shield is provided on a major surface layer of the first printed board and on an inner layer of the second printed board, and

the electronic parts are surrounded by the inter-board coupling connector and the wiring shields of the first printed board and the second printed board.

5 . The circular board device according to claim 4 , wherein an inner via is provided at the first printed board or the second printed board thereby to couple to the coupling terminal of the inter-board coupling connector.

Assignments (2)
CHANGE OF NAME Recorded Nov 11, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021818/0725 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 20, 2007
From: YAMAGUCHI, HIROYUKI; NAKANISHI, KIYOSHI; MURAMATSU, KEN; SUZUKI, HIROYUKI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 019717/0237 →