IP Library Granted Patent US 7,791,357
Granted Patent B2
US 7,791,357 · App. 11/722,629 · Granted Sep 7, 2010

On silicon interconnect capacitance extraction

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Quick Facts
Patent No.
US 7,791,357
App. No.
11/722,629
Granted
Sep 7, 2010
Kind
B2
Abstract

The present invention relates to a on-chip circuit for on silicon interconnect capacitance (Cx) extraction that is self compensated for process variations in the integrated transistors. The circuit ( 10 ) comprises signal generation means ( 20 ) for generating a periodical pulse signal connected to first and to second signal delaying means ( 31, 32 ) for respective delaying said pulse signal, wherein said second signal delaying means ( 32 ) are configured to have a delay affected by said interconnect capacitance (Cx); a logical XOR gate ( 35 ) for connecting respective first and said second delay signals of said respective first and second delay means ( 31, 32 ), said logical XOR gate ( 35 ) being connected to signal integrating means ( 40 ); and said signal integrating means ( 40 ) being connected to analog to digital converting means ( 50 ). Whilst the error in conventional uncompensated systems, like delay line only, the error can be up to 30%, in the circuit according to the invention, the error due to process variations in the front-end is about 2%. Further, an output is provided in a digital format and thus, can be measured quickly with simple external hardware. Furthermore, the pulse signal frequency can be used as a monitor to measure process variations in the front-end. Moreover, since the circuit ( 10 ) is remarkably accurate and very easy to measure, it is the best choice as a process monitor for every chip fabricated in the future.

Claims (22)

1. A circuit for interconnect capacitance measurement integrated on a semiconductor chip comprising:

signal generation means for generating a periodical pulse signal connected to an input of a first signal delaying means and to an input of a second signal delaying means, wherein each of the first and second signal delaying means delays said pulse signal, and wherein said second signal delaying means is configured to have a delay affected by said interconnect capacitance;

a logical exclusive or (XOR) gate means for receiving the first and second delay signals from the outputs of said first and second delay means, the output of said logical XOR gate means being connected to the input of signal integrating means; and

the output of said signal integrating means being connected to analog to digital converting means.

2. The circuit according to claim 1 further comprising frequency counting means connected to said signal generation means.

3. The circuit according to claim 1 , wherein said signal generation means comprises a logical NAND gate means and a feed-back loop with a first even number of consecutive connected logical gate elements.

4. The circuit according to claim 3 , wherein each of said logical gate elements is a logical inverter gate means.

5. The circuit according to claim 1 , wherein each of said first and second delay means comprises a second even number of consecutive connected logical gate elements, said logical gate elements of said second delay means being loaded at respective outputs with said capacitance.

6. The circuit according to claim 5 , wherein each of said first and second delay means further comprise an additional logical gate element interconnected between said respective delay means and said logical XOR gate means.

7. The circuit according to claim 1 , wherein said circuit is integrated on a semiconductor chip containing other integrated circuitry.

8. A semiconductor chip comprising a circuit according to claim 1 .

9. The circuit according to claim 1 , wherein at least one of said first signal delaying means and said second signal delaying means of said circuit is not a ring oscillator.

10. The circuit according to claim 1 , wherein neither said first signal delaying means nor said second signal delaying means of said circuit is a ring oscillator.

11. A method for extraction of interconnect capacitance in a semiconductor chip, comprising the steps of:

generating a periodic pulse signal;

delaying said pulse signal by a first and by a second delay means, wherein a delay of said second delay means is affected by said capacitance;

logically combining said respective first delayed pulse signal and second delayed pulse signal by a logical exclusive or (XOR) function for deriving a differential pulse signal;

integrating said differential pulse signal; and

converting said integrated differential pulse signal into a digital output signal.

12. The method according to claim 11 , said method further comprising the step of counting a pulse frequency of said pulse signal of said generating step.

13. The method according to claim 11 , wherein at least one of said first signal delaying means and said second signal delaying means of said circuit is not a ring oscillator.

14. The method according to claim 11 , wherein neither said first signal delaying means nor said second signal delaying means of said circuit is a ring oscillator.

Assignments (10)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2009
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 022856/0807 →